Abstract: A light-emitting apparatus includes: a transparent substrate; electrically conductive traces, bond pads, or land pads on the substrate; LEDs; and transparent molded material. The traces, bond pads, and land pads can be transparent, or can be sufficiently small and sufficiently sparse, to enable visual observation of a scene through the substrate and the traces, bond pads, or land pads. The LEDs are connected to the bond pads, and are sufficiently small and sparse so as to enable visual observation of the scene through them. The molded material can be a thermoplastic material or a thermoset material and is molded directly onto the substrate surface, without any intervening adhesive, and encapsulates the LEDs and the traces, bond pads, or land pads. Molten material or liquid precursors are injected into a mold enclosing the substrate with the LEDs and the traces, bond pads, or land pads.

Abstract: Various embodiments include methods for forming domed light-emitting diode (LED)-modules and devices constructed by those methods. In one example, the domed LED-module includes a package substrate, an LED die formed on the package substrate, one or more silicone pads formed on the package substrate and at least partially surrounding the LED die, and a high refractive-index material formed over the one or more silicone pads. Other devices and methods are described.