Abstract: One or more example embodiments of the present invention relates to a detector module for an X-ray detector comprising a sensor layer in a stacked construction configured to convert incident X-ray radiation into electrical signals; a readout layer configured to read out the electrical signals from the sensor layer; and a heating layer, the heating layer including a plurality of heating elements spatially distributed in the heating layer and configured separately from one another for heating the sensor layer, and wherein the readout layer has for each heating element an associated activatable adapting unit via which each heating element is contacted for feeding in power and which is configured to adapt the power fed to each heating element.

Abstract: An evaluation circuit for an x-ray detector for signaling coupling to a converter, designed to convert incident x-radiation into electrical signals. In at least one embodiment, the evaluation circuit includes a multiplicity of pixel-electronics modules. A respective pixel-electronics module is designed to process electrical signals fed into the respective pixel-electronics module from the converter, order to produce a respective digital pixel-measurement signal. Further, each of the respective pixel-electronics modules has at least one respective settable digital signal-processor, designed to adapt a respective processed digital pixel-measurement signal in a respective pixel-electronics module.

Abstract: A detector module for an X-ray detector includes: a sensor unit configured to convert incoming X-rays into electrical signals; at least one readout unit configured to read out the electrical signals from the sensor unit; a radio module with a radio circuit, which is configured to transmit the readout electrical signals by a wireless data transmission method; and an electronic unit arranged in a stacked arrangement with respect to the sensor unit having at least one electrically conductive connection for forwarding the readout electrical signals from the at least one readout unit to the radio module, wherein the radio circuit of the radio module is at least partially embedded in an embedding material of the electronic unit.

Abstract: A detector apparatus for a computed tomography device includes: at least one detector module having a sensor configured to detect measurement signals; at least one radio unit assigned to the at least one detector module, the radio unit having at least one radio antenna for wireless data transmission of the detector signals; and a housing that at least partially encloses the at least one detector module. The housing has a recess for the at least one radio antenna, relative to which the at least one radio antenna is arranged, so that wireless data transmission of the detector signals through the housing is enabled.

Abstract: A detector module for an X-ray detector comprises: a stacked structure having a sensor layer, a readout layer, a heating layer, and a wiring unit, wherein the wiring unit is positioned after the heating layer in the stacked structure. The heating layer is partitioned into a plurality of heating subregions, each of which includes at least one heating element, and with each of which contact can be made individually for supplying power. Through the wiring unit, contact is made to each of the plurality of heating subregions of the heating layer, and at least one subset of the plurality of heating subregions is interconnected for the supply of power.

Abstract: An X-ray detector module includes a plurality of evaluation circuits, coupled to at least one converter circuit, each evaluation circuit including a multiplicity of pixel electronics circuits for processing the electrical signals from the converter circuit pixel by pixel; and a number of forwarding circuits, a forwarding circuit including at least a first data input for receiving a measured data set from a first evaluation circuit and at least a second data input for receiving a measured data set from a second evaluation circuit, or for receiving at least one forwarded measured data set from a further forwarding circuit of the number of forwarding circuits. Each forwarding circuit is constructed to forward the measured data sets that are received by way of the first data input and second data input to a coupled receiving circuit over a common data output.

Abstract: An evaluation circuit for an x-ray detector for signaling coupling to a converter, designed to convert incident x-radiation into electrical signals. In at least one embodiment, the evaluation circuit includes a multiplicity of pixel-electronics modules. A respective pixel-electronics module is designed to process electrical signals fed into the respective pixel-electronics module from the converter, order to produce a respective digital pixel-measurement signal. Further, each of the respective pixel-electronics modules has at least one respective settable digital signal-processor, designed to adapt a respective processed digital pixel-measurement signal in a respective pixel-electronics module.

Abstract: An X-ray detector module includes a plurality of evaluation circuits, coupled to at least one converter circuit, each evaluation circuit including a multiplicity of pixel electronics circuits for processing the electrical signals from the converter circuit pixel by pixel; and a number of forwarding circuits, a forwarding circuit including at least a first data input for receiving a measured data set from a first evaluation circuit and at least a second data input for receiving a measured data set from a second evaluation circuit, or for receiving at least one forwarded measured data set from a further forwarding circuit of the number of forwarding circuits. Each forwarding circuit is constructed to forward the measured data sets that are received by way of the first data input and second data input to a coupled receiving circuit over a common data output.

Abstract: An x-ray detector includes a sensor slice for directly converting x-ray radiation and a downstream read-out chip. Further, in at least one embodiment, a first amplifier stage is interconnected between the sensor slice and read-out chip.

Abstract: A photon detector includes at least one sensor element, formed by a semiconductor material and sensitive to incident radiation, forming a pixel array including sensor pixels; and a detector circuit, situated after the sensor element in the direction of incident radiation, to detect charge carriers generated in the semiconductor material as a result of radiation. The detector circuit includes an integrated circuit with detector pixels in signal communication contact with the sensor pixels; and an enclosure surrounding the integrated circuit and in which the integrated circuit is embedded, and on which is formed on a pixel face facing the sensor element. A contact redistribution layer is formed, in which contact pads are formed for signal-communicatively connecting the detector pixels to the correspondingly assigned sensor pixels, and also conductor tracks are formed for connecting the contact pads to the detector pixels of the integrated circuit.

Abstract: A detector apparatus for use as part of a data network includes a plurality of x-ray detectors, each of the plurality of x-ray detectors including a network-capable network interface, and a switch or router, connected to each of the network-capable network interfaces of the plurality of x-ray detectors, each of the plurality of x-ray detectors including a distinct IP address such that the data network is adjustable to take a change in a number of the plurality of x-ray detectors into account. The plurality of x-ray detectors are configured to detect x-rays generated from a single x-ray source.

Abstract: An x-ray detector includes a sensor slice for directly converting x-ray radiation and a downstream read-out chip. Further, in at least one embodiment, a first amplifier stage is interconnected between the sensor slice and read-out chip.

Abstract: A radiation detector includes an intermediate layer, which is arranged between a detection layer with a number of detection elements and a number of readout units. In an example embodiment of this arrangement, the intermediate layer has a plurality of electrically-conductive connections between the detection elements and the readout units. An example embodiment further specifies a medical imaging system, as well as a method of using the heating apparatus.

Abstract: A method is for producing an integrated circuit. In an embodiment, a metallic contact structure, for a through silicon via with a contact area, is applied onto a silicon substrate without an insulating intermediate layer. An interconnection structure, with at least one insulating layer and at least one interconnection layer, is applied onto the silicon substrate. The contact structure is or will be contacted with the interconnection layer or at least one of the possibly plurality of interconnection layers, and a diode structure for blocking a current flow between the contact area of the metallic contact structure and the silicon substrate is introduced into the silicon substrate.

Abstract: A photon detector includes at least one sensor element, formed by a semiconductor material and sensitive to incident radiation, forming a pixel array including sensor pixels; and a detector circuit, situated after the sensor element in the direction of incident radiation, to detect charge carriers generated in the semiconductor material as a result of radiation. The detector circuit includes an integrated circuit with detector pixels in signal communication contact with the sensor pixels; and an enclosure surrounding the integrated circuit and in which the integrated circuit is embedded, and on which is formed on a pixel face facing the sensor element. A contact redistribution layer is formed, in which contact pads are formed for signal-communicatively connecting the detector pixels to the correspondingly assigned sensor pixels, and also conductor tracks are formed for connecting the contact pads to the detector pixels of the integrated circuit.

Abstract: A radiation detector includes an intermediate layer, which is arranged between a detection layer with a number of detection elements and a number of readout units. In an example embodiment of this arrangement, the intermediate layer has a plurality of electrically-conductive connections between the detection elements and the readout units. An example embodiment further specifies a medical imaging system, as well as a method of using the heating apparatus.

Abstract: A detector apparatus for use as part of a data network includes a plurality of x-ray detectors, each of the plurality of x-ray detectors including a network-capable network interface, and a switch or router, connected to each of the network-capable network interfaces of the plurality of x-ray detectors, each of the plurality of x-ray detectors including a distinct IP address such that the data network is adjustable to take a change in a number of the plurality of x-ray detectors into account. The plurality of x-ray detectors are configured to detect x-rays generated from a single x-ray source.

Abstract: A radiation detector includes an intermediate layer, which is arranged between a detection layer with a number of detection elements and a number of readout units. In an example embodiment of this arrangement, the intermediate layer has a plurality of electrically-conductive connections between the detection elements and the readout units. An example embodiment further specifies a medical imaging system, as well as a method of using the heating apparatus.

Abstract: A detector apparatus includes at least one x-ray detector, including a network-capable network unit; and a switching unit connected to the network unit of the x-ray detector.

Abstract: A method is for producing an integrated circuit. In an embodiment, a metallic contact structure, for a through silicon via with a contact area, is applied onto a silicon substrate without an insulating intermediate layer. An interconnection structure, with at least one insulating layer and at least one interconnection layer, is applied onto the silicon substrate. The contact structure is or will be contacted with the interconnection layer or at least one of the possibly plurality of interconnection layers, and a diode structure for blocking a current flow between the contact area of the metallic contact structure and the silicon substrate is introduced into the silicon substrate.