Patents by Inventor Michael Huff
Michael Huff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11927281Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve that uses a multicity of piezoelectric actuators. The 3-way has a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The three-way microvalve device and method of fabrication can be tailored to the requirements of a wide range of applications and fluid types. The microvalve can be used to control fluids at high pressures and provides for low flow resistances when the microvalve is open and has low leakage when closed.Type: GrantFiled: July 5, 2022Date of Patent: March 12, 2024Assignee: Corporation for National Research InitiativesInventors: Michael A. Huff, Mehmet Ozgur
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Patent number: 11926522Abstract: A package and method of packaging for integrated microfluidic devices and systems is disclosed wherein a package is made from individually processed and patterned layers of LTCC green tape, that is aligned and stacked, and then co-fired to form a stable LTCC ceramic packaging modules. Subsequently, microfluidic device die and/or integrated microfluidic systems device die are bonded to pre-determined areas of the packaging modules and the modules are aligned bonded together to form leak-free, sealed packages for the microfluidic devices and systems. The use of LTCC materials and techniques provides a low-cost flexible and easily customizable packaging approach for microfluidic devices and systems that can be designed and transitioned into production with significant development time and cost.Type: GrantFiled: April 12, 2022Date of Patent: March 12, 2024Assignee: Corporation for National Research InitiativesInventor: Michael A. Huff
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Patent number: 11916840Abstract: Aspects of the present disclosure include methods, apparatuses, and computer readable media for receiving at least one TP packet, computing a current data rate or an end time of a low throughput phase, determining if TP is in the low throughput phase, aggregating the at least one received TP packet or an ACK relating to the at least one received TP packet in response to determining that the TP is not in the low throughput phase, and transmitting the ACK to a sending device.Type: GrantFiled: February 13, 2020Date of Patent: February 27, 2024Assignee: QUALCOMM IncorporatedInventors: Prachi Agrawal, Arnaud Meylan, Vandit Pinal Desai, Rajashekar Chilla, Prasad Gadde, Hariharan Subramanian, Vamsi Dokku, Ryan Michael Chapman, Subash Abhinov Kasiviswanathan, Sean Nicholas Tranchetti, Raul Martinez, Conner Austin Huff
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Patent number: 11788646Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve which uses a single piezoelectric actuator. The present invention has a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The present invention allows for the implementation of a three-way microvalve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types. The microvalve may employ a novel pressure-balancing scheme wherein the fluid pressure balances the actuator mechanism so that only a small amount of actuation pressure (or force) is needed to switch the state of the actuator and device from open to closed, or closed to open.Type: GrantFiled: April 8, 2022Date of Patent: October 17, 2023Assignee: Corporation for National Research InitiativesInventor: Michael Huff
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Publication number: 20230102861Abstract: A method for depositing, patterning and removing a layer of aluminum oxide as a masking material layer for performing a deep, high-aspect ratio etches into a substrate. The method comprising deposing a photoresist onto the substrate, performing lithography processing on the photoresist, developing the photoresist to pattern the photoresist into a mask design, depositing a thin-film layer of aluminum oxide; immersing the substrate into a solution to lift-off the aluminum oxide in regions where the aluminum oxide is deposited on top of the photoresist thereby leaving the patterned aluminum oxide layer on the substrate where no photoresist was present, performing deep reactive ion etching on the substrate wherein the hard masking material layer composed of aluminum oxide functions as a protective masking layer on the substrate to prevent etching from occurring where the aluminum oxide is present, and removing the aluminum oxide masking layer by immersion in a solution.Type: ApplicationFiled: September 27, 2021Publication date: March 30, 2023Inventor: Michael A. HUFF
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Patent number: 11485334Abstract: A method and system for braking a vehicle using supplemental deceleration provided by an electronic parking brake. The method includes detecting a reduced function state of an integrated braking system; detecting a brake pedal input from an operator of the vehicle; and automatically generating a braking force via the electronic parking brake based on the brake pedal input and the reduced function state.Type: GrantFiled: May 24, 2018Date of Patent: November 1, 2022Assignee: Robert Bosch GmbHInventors: E. Michael Huff, Ryan A. Kuhlman, Christian Meister
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Patent number: 11326717Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve which uses a single piezoelectric actuator. The present invention has a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The present invention allows for the implementation of a three-way microvalve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types. The microvalve may employ a novel pressure-balancing scheme wherein the fluid pressure balances the actuator mechanism so that only a small amount of actuation pressure (or force) is needed to switch the state of the actuator and device from open to closed, or closed to open.Type: GrantFiled: February 12, 2018Date of Patent: May 10, 2022Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventor: Michael Huff
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Patent number: 11075086Abstract: A method for the etching of deep, high-aspect ratio features into silicon carbide (SiC), gallium nitride (GaN) and similar materials using an Inductively-Coupled Plasma (ICP) etch process technology is described. This technology can also be used to etch features in silicon carbide and gallium nitride having near vertical sidewalls. The disclosed method has application in the fabrication of electronics, microelectronics, power electronics, Monolithic Microwave Integrated Circuits (MMICs), high-voltage electronics, high-temperature electronics, high-power electronics, Light-Emitting Diodes (LEDs), Micro-Electro-Mechanical Systems (MEMS), micro-mechanical devices, microelectronic devices and systems, nanotechnology devices and systems, Nano-Electro-Mechanical Systems (NEMS), photonic devices, and any devices and/or structures made from silicon carbide and/or gallium nitride.Type: GrantFiled: February 12, 2018Date of Patent: July 27, 2021Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventors: Mehmet Ozgur, Michael Pedersen, Michael A. Huff
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Patent number: 11049725Abstract: A method for the etching of deep, high-aspect ratio features into silicon carbide (SiC), gallium nitride (GaN) and similar materials using an Inductively-Coupled Plasma (ICP) etch process technology is described. This technology can also be used to etch features in silicon carbide and gallium nitride having near vertical sidewalls. The disclosed method has application in the fabrication of electronics, microelectronics, power electronics, Monolithic Microwave Integrated Circuits (MMICs), high-voltage electronics, high-temperature electronics, high-power electronics, Light-Emitting Diodes (LEDs), Micro-Electro-Mechanical Systems (MEMS), micro-mechanical devices, microelectronic devices and systems, nanotechnology devices and systems, Nano-Electro-Mechanical Systems (NEMS), photonic devices, and any devices and/or structures made from silicon carbide and/or gallium nitride.Type: GrantFiled: May 29, 2014Date of Patent: June 29, 2021Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventors: Mehmet Ozgur, Michael Pedersen, Michael A. Huff
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Patent number: 11035496Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve are disclosed. The micro-valve device has a wide range of applications, including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The discloses three-way micro-valve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types, and can also use a number of different actuation methods, including actuation methods that have very small actuation pressures and energy densities even at higher fluidic pressures.Type: GrantFiled: April 29, 2019Date of Patent: June 15, 2021Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventor: Michael A. Huff
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Patent number: 10910185Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto an electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.Type: GrantFiled: July 31, 2019Date of Patent: February 2, 2021Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventors: Mehmet Ozgur, Paul Sunal, Lance Oh, Michael Huff, Michael Pedersen
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Publication number: 20200094801Abstract: A method and system for braking a vehicle using supplemental deceleration provided by an electronic parking brake. The method includes detecting a reduced function state of an integrated braking system; detecting a brake pedal input from an operator of the vehicle; and automatically generating a braking force via the electronic parking brake based on the brake pedal input and the reduced function state.Type: ApplicationFiled: May 24, 2018Publication date: March 26, 2020Inventors: E. Michael Huff, Ryan A. Kuhlman, Christian Meister
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Publication number: 20200025311Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve are disclosed. The micro-valve device has a wide range of applications, including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The discloses three-way micro-valve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types, and can also use a number of different actuation methods, including actuation methods that have very small actuation pressures and energy densities even at higher fluidic pressures.Type: ApplicationFiled: April 29, 2019Publication date: January 23, 2020Inventor: Michael A. HUFF
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Publication number: 20190355538Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto an electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.Type: ApplicationFiled: July 31, 2019Publication date: November 21, 2019Inventors: Mehmet OZGUR, Paul SUNAL, Lance OH, Michael HUFF, Michael PEDERSEN
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Patent number: 10403463Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto a electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.Type: GrantFiled: December 22, 2017Date of Patent: September 3, 2019Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventors: Mehmet Ozgur, Paul Sunal, Lance Oh, Michael Huff, Michael Pedersen
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Patent number: 10323772Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve are disclosed. The micro-valve device has a wide range of applications, including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The discloses three-way micro-valve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types, and can also use a number of different actuation methods, including actuation methods that have very small actuation pressures and energy densities even at higher fluidic pressures.Type: GrantFiled: October 1, 2015Date of Patent: June 18, 2019Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventor: Michael A. Huff
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Publication number: 20180197711Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto a electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.Type: ApplicationFiled: December 22, 2017Publication date: July 12, 2018Inventors: Mehmet Ozgur, Paul Sunal, Lance Oh, Michael Huff, Michael Pedersen
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Patent number: 9852870Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto a electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.Type: GrantFiled: May 23, 2011Date of Patent: December 26, 2017Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventors: Mehmet Ozgur, Paul Sunal, Lance Oh, Michael Huff, Michael Pedersen
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Patent number: 9646878Abstract: A method is disclosed for manufacturing integrated circuits, microelectronics, micro-electro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS), photonic, and any micro- and nano-fabricated devices and systems designs that allow these designs to be kept secure. The manufacturing of the devices in the substrates is performed in a traditional manner at a foundry that can be located anywhere in the world., The manufacturing at this foundry is stopped just before the fabrication of the first layer of electrical interconnects. At this stage, the semiconductor substrates with the devices, minus electrical interconnects, are sent back to the design organization (or their designated trusted foundry) to perform the fabrication of the electrical interconnects to complete the entire manufacturing process.Type: GrantFiled: June 19, 2014Date of Patent: May 9, 2017Assignee: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventor: Michael A. Huff
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Publication number: 20170097108Abstract: A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve are disclosed. The micro-valve device has a wide range of applications, including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The discloses three-way micro-valve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types, and can also use a number of different actuation methods, including actuation methods that have very small actuation pressures and energy densities even at higher fluidic pressures.Type: ApplicationFiled: October 1, 2015Publication date: April 6, 2017Inventor: Michael A. Huff