Abstract: An infrared sensor positioned in a reflow oven includes a reflow oven and a first IR sensor turret suspended over a conveyor surface of the reflow oven, where a directional movement of the first IR sensor turret matches a directional movement of the conveyor surface. A method for managing the IR sensor turret positioned in a reflow oven includes locating, by a first IR sensor turret, a point of interest on a PCBA, where the PCBA is positioned on a conveyor in a reflow oven. The method further includes tracking, by the first IR sensor turret, the point of interest on the PCBA, where the PCBA is moving along the conveyor in the reflow oven. The method further includes capturing, by the first IR sensor turret, a first set of thermal data at the point of interest for a first subarea of the reflow oven.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: Methods for operating a communications-enabled application, controlling a secure profile via an operating system, and operating a cellular network are provided. Operating a communications-enable application includes detecting a need for data transmission when the mobile device has a communications status which is incompatible with the need and sending a request to activate a secure profile. Controlling the secure profile includes receiving a request from an application to have data session access via a secure profile and activating a data session utilising a secure profile. Operating the cellular network includes receiving a request to establish a cellular network data communications session from a mobile device including the communications-enabled application and establishing a data session with the mobile device using the secure profile. A mobile device and cellular network for performing the methods are also provided.

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: An aqueous cleaning solution for removing rouging deposits on media-contacted surfaces of stainless steels comprises a first component and a second component. The first component is an alkali sulfite and the second component is an alkali formate, wherein the concentrations thereof are adjusted in such manner that formate is present in a molar ratio of 1.5 to 4.2 relative to sulfite, and that the pH value of the cleaning solution is 4.0 to 4.8. For preparing the aqueous cleaning solution, an aqueous solution of an alkali hydroxide is provided initially, thereafter a first amount of concentrated aqueous formic acid is admixed in an excess in such manner that a pH value of 3.5 to 4.5 is established, then a second amount of solid alkali sulfite is admixed in accordance with the sulfite concentration to be established, thus resulting in a pH value of 5.5 to 6.5, and finally a third amount of concentrated aqueous formic acid is admixed until a pH value of 4.0 to 4.8 is attained.

Abstract: A controlled extraction of an electronic connector from an electronic circuit board includes a press mechanism of a device positioned in spaced relation over a base fixture of the device. The base fixture receiving an electronic circuit board which includes a connector. Shafts of a removal tool of the press mechanism can be inserted into a series of openings in the connector, respectively, in response to applying a downward force to the press mechanism. A capturing element on each of the shafts can be actuated where the capturing element couples to a wall defining the opening of each of the openings. The connector can be removed from the electronic circuit board by applying an upward force to the press mechanism which removes the connector with the capturing element of the shafts coupled to the wall of the opening, and releasing the press mechanism from the base fixture.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: An aqueous cleaning solution for removing rouging deposits on media-contacted surfaces of stainless steels comprises a first component and a second component. The first component is an alkali sulfite and the second component is an alkali formate, wherein the concentrations thereof are adjusted in such manner that formate is present in a molar ratio of 1.5 to 4.2 relative to sulfite, and that the pH value of the cleaning solution is 4.0 to 4.8. For preparing the aqueous cleaning solution, an aqueous solution of an alkali hydroxide is provided initially, thereafter a first amount of concentrated aqueous formic acid is admixed in an excess in such manner that a pH value of 3.5 to 4.5 is established, then a second amount of solid alkali sulfite is admixed in accordance with the sulfite concentration to be established, thus resulting in a pH value of 5.5 to 6.5, and finally a third amount of concentrated aqueous formic acid is admixed until a pH value of 4.0 to 4.8 is attained.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: An aqueous cleaning solution for removing rouging deposits on media-contacted surfaces of stainless steels comprises a first component and a second component. The first component is an alkali sulfite and the second component is an alkali formate, wherein the concentrations thereof are adjusted in such manner that formate is present in a molar ratio of 1.5 to 4.2 relative to sulfite, and that the pH value of the cleaning solution is 4.0 to 4.8. For preparing the aqueous cleaning solution, an aqueous solution of an alkali hydroxide is provided initially, thereafter a first amount of concentrated aqueous formic acid is admixed in an excess in such manner that a pH value of 3.5 to 4.5 is established, then a second amount of solid alkali sulfite is admixed in accordance with the sulfite concentration to be established, thus resulting in a pH value of 5.5 to 6.5, and finally a third amount of concentrated aqueous formic acid is admixed until a pH value of 4.0 to 4.8 is attained.

Abstract: A method includes providing a printed circuit board (“PCB”) supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding a first threshold temperature. The PCB, the solderable component, and the first fuse define an apparatus. The method includes performing a PCB assembly manufacturing process, and then testing the first fuse to determine whether, during the PCB assembly manufacturing process, the first fuse was exposed to ambient thermal conditions exceeding a first threshold temperature. The first threshold temperature is a minimum temperature where the PCB assembly manufacturing process is to be carried out, a maximum temperature at which the PCB assembly manufacturing process is to occur, or a first intermediate temperature between the minimum and maximum temperatures.

Abstract: An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatus such as in in-circuit tester after a process such as a solder assembly process to determine whether the process was performed within the desire temperature range. Fuses may be positioned at different locations on the printed circuit board to provide localized and differentiated temperature measurements. An array of fuses may be designed to change at a progressing sequence of ambient temperatures to enable trends in the process temperature to be recorded. Temperature data may be recorded and linked to an identifier on the apparatus such as a product serial number.

Abstract: A method includes providing a printed circuit board (“PCB”) supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding a first threshold temperature. The PCB, the solderable component, and the first fuse define an apparatus. The method includes performing a PCB assembly manufacturing process, and then testing the first fuse to determine whether, during the PCB assembly manufacturing process, the first fuse was exposed to ambient thermal conditions exceeding a first threshold temperature. The first threshold temperature is a minimum temperature where the PCB assembly manufacturing process is to be carried out, a maximum temperature at which the PCB assembly manufacturing process is to occur, or a first intermediate temperature between the minimum and maximum temperatures.