Abstract: An analogue circuit design apparatus is disclosed herein. The analogue circuit design apparatus is configured to receive information representing technical requirements for the analogue circuit, wherein the technical requirements comprise (i) at least one circuit performance requirement, and (ii) at least one manufacturing requirement for the analogue circuit to satisfy a specific set of manufacturing process related rules. The analogue circuit design apparatus is configured to identify a plurality of potential analogue circuit design architectures, for satisfying the circuit performance requirement, that will satisfy the at least one manufacturing requirement and select, as a current analogue circuit design architecture, an initial analogue circuit design architecture from among the plurality of potential analogue circuit design architectures, wherein the selection of the initial analogue circuit design is dependent on the set of manufacturing process related rules.

Abstract: An analogue circuit design apparatus is disclosed comprising a primary design unit and a plurality of secondary design units.

Abstract: An analogue circuit design apparatus is disclosed comprising a primary design unit and a plurality of secondary design units. The primary design unit is configured to: identify a plurality of circuit portions for forming the analogue circuit; determine for each circuit portion respective technical criteria; and provide the respective technical criteria to at least one of a plurality of secondary design units. Each of the plurality of secondary design units is configured to: design a respective circuit portion based on the technical criteria for that respective circuit portion; and output a resulting initial design of the respective circuit portion. After at least an initial design of a given circuit portion has been completed by at least another one of the secondary design units, at least one of the secondary design units is configured to adapt its output initial design based on a context of its corresponding circuit portion.

Abstract: An analogue circuit design apparatus is disclosed comprising a primary design unit and a plurality of secondary design units. The primary design unit is configured to: identify a plurality of circuit portions for forming the analogue circuit; determine for each circuit portion respective technical criteria; and provide the respective technical criteria to at least one of a plurality of secondary design units. Each of the plurality of secondary design units is configured to: design a respective circuit portion based on the technical criteria for that respective circuit portion; and output a resulting initial design of the respective circuit portion.

Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

Abstract: An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.

Abstract: Devices, methods, and systems for two-phase thermal management are provided in accordance with various embodiments. For example, a two-phase thermal management device is provided that may include two or more containment layers and/or one or more porous layers positioned between at least a portion of each of the two or more containment layers. The portion of each of the two or more containment layers and the one or more porous layers may be bonded with each other. The two or more containment layers and one or more porous layers may be bonded with each other to form an uninterrupted stack of material layers utilizing diffusion bonding. Some embodiments include a method of forming a two-phase thermal management device including arranging multiple materials layers including one or more porous layers positioned with respect to one or more containment layers; and/or bonding the multiple material layers with each other.

Abstract: An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.

Abstract: Passively deployable thermal management devices, systems, and methods are provided in accordance with various embodiments. For example, some embodiments include a passively deployable radiator device that may include: one or more thermally conductive layers; and/or one or more strain energy components configured to deploy passively the one or more thermally conductive layers. The one or more thermally conductive layers may include one or more carbon layers. The one or more carbon layers may include at least one or more graphite layers or one or more graphene layers. At least the one or more graphite layers or the one or more graphene layers include at least one or more pyrolytic graphite sheets or one or more pyrolytic graphene sheets.

Abstract: Devices, methods, and systems for two-phase thermal management are provided in accordance with various embodiments. For example, a two-phase thermal management device is provided that may include two or more containment layers and/or one or more porous layers positioned between at least a portion of each of the two or more containment layers. The portion of each of the two or more containment layers and the one or more porous layers may be bonded with each other. The two or more containment layers and one or more porous layers may be bonded with each other to form an uninterrupted stack of material layers utilizing diffusion bonding. Some embodiments include a method of forming a two-phase thermal management device including arranging multiple materials layers including one or more porous layers positioned with respect to one or more containment layers; and/or bonding the multiple material layers with each other.

Abstract: A vacuum insulating glazing unit (VIGU) comprises two or more glass lites (panes) spaced apart from one another and hermetically bonded to an edge seal assembly therebetween. The resulting cavity between the lites is evacuated to create at least one insulating vacuum cavity within which are disposed a plurality of stand-off members to maintain separation between the lites. The edge seal assembly is preferably compliant in the longitudinal (i.e., edgewise) direction to allow longitudinal relative motion between the two lites (e.g., from thermal expansion). The longitudinal compliance may be obtained by imprinting a three-dimensional pattern into the edge seal material. The edge seal assembly is preferably bonded to the lites with a first bond portion that is hermetic and a second bond portion that is load-resistant. Methods for producing VIGUs and/or compliant edge seal assemblies and VIGU and edge seal apparatus are disclosed.

Abstract: Methods, systems, and device for two-phase thermal management are provided in accordance with various embodiments. For example, some embodiments include a two-phase thermal management device that may include: a liquid chamber; one or more inlets configured to deliver a liquid to the liquid chamber; an evaporator chamber; a capillary layer positioned within the evaporator chamber and configured to spread the liquid from the liquid chamber; a liquid manifold configured to deliver the liquid from the liquid chamber to at least the capillary layer or the evaporator chamber; and/or one or more outlets configured to remove at least a vapor or a portion of the liquid from the evaporator chamber. Some embodiments that may include a two-phase thermal management device coupled with at least: a heat exchanger, a pump, a heat recuperator, a pre-heater, and/or a variable volume reservoir. Some embodiments include a two-phase thermal management method.

Abstract: Methods, systems, and device for bendable flat heat pipes are provided in accordance with various embodiments. For example, some embodiments include a device that includes one or more containment layers. A wick and vapor layer may be positioned between two containment layers or between two portions of a containment layer; the wick and vapor layer may include both wick and vapor channels. Some embodiments include multiple cross ribs that may run laterally on either side or both sides of the wick and vapor layer. In some embodiments, the containment layer(s), the wick and vapor layer, and the multiple cross ribs are bonded with each other to form the device. In addition, the device may be charged with a working fluid.

Abstract: Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.

Abstract: Deployable radiator devices, systems, and methods utilizing composite laminates are provide in accordance with various embodiments. For example, some embodiments include a deployable radiator system. The system may include one or more radiators and one or more thermally-conductive, bendable hinges. Each respective thermally-conductive, bendable hinge from the one or more thermally-conductive, bendable hinges may be coupled with a respective radiator from the one or more radiators. Each respective thermally-conductive, bendable hinge from the one or more thermally-conductive, bendable hinges may be configured to conduct heat to the respective radiator from the one or more radiators. Some embodiments include one or more heat pipes, which may be flat. Some embodiments include heat pipes with vapor channels and liquid channels configured in a same plane of the heat pipe. Methods of utilizing the systems and/or devices may be also provided.

Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

Abstract: A network asset location system and methods of its use and operation are disclosed. In one aspect, the network asset location system includes a mobile application component executable on a mobile device including a camera and a display, the mobile application component configured to receive image data from the camera and display an image on the display based on the image data and overlay information identifying one or more network assets identifiable in the image data. The network asset location system also includes an asset management tracking engine configured to receive the image data and generate the overlay information including an identification of a location of at least one of the one or more network assets within the image.

Abstract: Methods, systems, and device for two-phase thermal management are provided in accordance with various embodiments. For example, some embodiments include a two-phase thermal management device that may include: a liquid chamber; one or more inlets configured to deliver a liquid to the liquid chamber; an evaporator chamber; a capillary layer positioned within the evaporator chamber and configured to spread the liquid from the liquid chamber; a liquid manifold configured to deliver the liquid from the liquid chamber to at least the capillary layer or the evaporator chamber; and/or one or more outlets configured to remove at least a vapor or a portion of the liquid from the evaporator chamber. Some embodiments that may include a two-phase thermal management device coupled with at least: a heat exchanger, a pump, a heat recuperator, a pre-heater, and/or a variable volume reservoir. Some embodiments include a two-phase thermal management method.

Abstract: A vacuum insulating glazing unit (VIGU) comprises two or more glass lites (panes) spaced apart from one another and hermetically bonded to an edge seal assembly therebetween. The resulting cavity between the lites is evacuated to create at least one insulating vacuum cavity within which are disposed a plurality of stand-off members to maintain separation between the lites. The edge seal assembly is preferably compliant in the longitudinal (i.e., edgewise) direction to allow longitudinal relative motion between the two lites (e.g., from thermal expansion). The longitudinal compliance may be obtained by imprinting a three-dimensional pattern into the edge seal material. The edge seal assembly is preferably bonded to the lites with a first bond portion that is hermetic and a second bond portion that is load-resistant. Methods for producing VIGUs and/or compliant edge seal assemblies and VIGU and edge seal apparatus are disclosed.