Patents by Inventor Michael Huynh

Michael Huynh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12283182
    Abstract: A computer-implemented method for establishing at least one low or zero emission traffic zone and for controlling and monitoring a dynamically operated drivetrain of hybrid vehicles passing through the at least one established low or zero emission traffic zone is provided.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: April 22, 2025
    Assignee: Ford Global Technologies, LLC
    Inventors: Roy Hendrikx, Stuart Easson, Adam Weber, Rathi Munukur, Tariq Alexander Willis, Michael Huynh, Alexandra Holz
  • Publication number: 20230347186
    Abstract: This disclosure involves systems and an apparatus for an in-mask display and mounting system for a display to be integrated into a positive pressure mask. In certain enclosed environments, emergency masks are used as a backup source of breathable atmosphere in the event the regular atmosphere becomes unusable. While the mask may enable breathing, smoke or other environmental factors may inhibit visibility. This disclosure provides an in-mask display, and mounting system to provide critical information to the user, regardless of visibility external to the mask. A mechanism is provided to allow the display to be translated vertically within the mask, allowing the user to align the display with their eyes. The display must also be mounted in a manner that minimizes mask penetrations and rejects any heat generated by the display outside of the mask.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventors: Nathan Klatt, Jean-Claude de Sugny, Michael Huynh, Kevin Ferguson, Divya Prasannan
  • Publication number: 20220165152
    Abstract: A computer-implemented method for establishing at least one low or zero emission traffic zone and for controlling and monitoring a dynamically operated drivetrain of hybrid vehicles passing through the at least one established low or zero emission traffic zone is provided.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 26, 2022
    Applicant: Ford Global Technologies, LLC
    Inventors: Roy Hendrikx, Stuart Easson, Adam Weber, Rathi Munukur, Tariq Alexander Willis, Michael Huynh, Alexandra Holz
  • Patent number: 8978247
    Abstract: A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second spaced-apart surfaces defining a thickness therebetween, a handling structure, and an insulating layer separating at least portions of the first surface of the support material layer from at least portions of the handling structure. The metalized structures are formed extending through the thickness of the support material layer. The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit and further processing the in-process unit to form the interconnection element.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 17, 2015
    Assignee: Invensas Corporation
    Inventors: Se Young Yang, Cyprian Emeka Uzoh, Michael Huynh, Rajesh Katkar
  • Publication number: 20130313012
    Abstract: A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second spaced-apart surfaces defining a thickness therebetween, a handling structure, and an insulating layer separating at least portions of the first surface of the support material layer from at least portions of the handling structure. The metalized structures are formed extending through the thickness of the support material layer. The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit and further processing the in-process unit to form the interconnection element.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 28, 2013
    Applicant: INVENSAS CORPORATION
    Inventors: Se Young Yang, Cyprian Emeka Uzoh, Michael Huynh, Rajesh Katkar