Patents by Inventor Michael I. Hvizdos

Michael I. Hvizdos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11276135
    Abstract: Techniques for improving data transfer in a system having multiple accelerated processing devices (“APDs”) are described herein. In such a system, multiple APDs are coupled to a processor (e.g., a central processing unit (“CPU”)) via a general interconnect fabric and to each other via a high speed interconnect. The techniques herein increase the effective bandwidth for transfer of data between the CPU and the APD by transmitting data to both APDs through the portion of the interconnect fabric coupled to each respective APD. Then, one of the APDs transfers data to the other APD or to the processor via the high speed inter-APD interconnect. Although data transferred “indirectly” through the helper APD takes slightly more time to be transferred than a direct transfer, the total effective bandwidth to the target is increased due to the high-speed inter-APD interconnect.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: March 15, 2022
    Assignee: ATI Technologies ULC
    Inventors: Syed Arshad Rahman, Michael I. Hvizdos, Leonid Shamis
  • Publication number: 20200258187
    Abstract: Techniques for improving data transfer in a system having multiple accelerated processing devices (“APDs”) are described herein. In such a system, multiple APDs are coupled to a processor (e.g., a central processing unit (“CPU”)) via a general interconnect fabric and to each other via a high speed interconnect. The techniques herein increase the effective bandwidth for transfer of data between the CPU and the APD by transmitting data to both APDs through the portion of the interconnect fabric coupled to each respective APD. Then, one of the APDs transfers data to the other APD or to the processor via the high speed inter-APD interconnect. Although data transferred “indirectly” through the helper APD takes slightly more time to be transferred than a direct transfer, the total effective bandwidth to the target is increased due to the high-speed inter-APD interconnect.
    Type: Application
    Filed: April 23, 2020
    Publication date: August 13, 2020
    Applicant: ATI Technologies ULC
    Inventors: Syed Arshad Rahman, Michael I. Hvizdos, Leonid Shamis
  • Patent number: 10672095
    Abstract: Techniques for improving data transfer in a system having multiple accelerated processing devices (“APDs”) are described herein. In such a system, multiple APDs are coupled to a processor (e.g., a central processing unit (“CPU”)) via a general interconnect fabric and to each other via a high speed interconnect. The techniques herein increase the effective bandwidth for transfer of data between the CPU and the APD by transmitting data to both APDs through the portion of the interconnect fabric coupled to each respective APD. Then, one of the APDs transfers data to the other APD or to the processor via the high speed inter-APD interconnect. Although data transferred “indirectly” through the helper APD takes slightly more time to be transferred than a direct transfer, the total effective bandwidth to the target is increased due to the high-speed inter-APD interconnect.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: June 2, 2020
    Assignee: ATI TECHNOLOGIES ULC
    Inventors: Syed Arshad Rahman, Michael I. Hvizdos, Leonid Shamis
  • Publication number: 20190188822
    Abstract: Techniques for improving data transfer in a system having multiple accelerated processing devices (“APDs”) are described herein. In such a system, multiple APDs are coupled to a processor (e.g., a central processing unit (“CPU”)) via a general interconnect fabric and to each other via a high speed interconnect. The techniques herein increase the effective bandwidth for transfer of data between the CPU and the APD by transmitting data to both APDs through the portion of the interconnect fabric coupled to each respective APD. Then, one of the APDs transfers data to the other APD or to the processor via the high speed inter-APD interconnect. Although data transferred “indirectly” through the helper APD takes slightly more time to be transferred than a direct transfer, the total effective bandwidth to the target is increased due to the high-speed inter-APD interconnect.
    Type: Application
    Filed: December 15, 2017
    Publication date: June 20, 2019
    Applicant: ATI Technologies ULC
    Inventors: Syed Arshad Rahman, Michael I. Hvizdos, Leonid Shamis