Abstract: Electrical circuits can be built up in three dimensions by using spacers which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks which have a number of continuous tracks. Link members are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission stacks.

Abstract: Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks (110). Link members (126, 128) are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission. stacks.

Abstract: A circuit assembly includes a mounting structure 10 having walls 11-13, 20 with conductor strips 19 running along the length of the structure. Plate members 14 carrying components such as integrated circuits 16 have conductive areas 18 which contact the conductor strips 19 when the members are inserted into the structure 10. The walls may include slots 15 into which the plate members 14 are slidably engaged. The support structure 10 thus provides physical support for the members 14 as well as electrical interconnection therebetween. Cooling arrangements for the assembly can include apertures 21 in the walls, and/or finning 22.

Abstract: A circuit unit such as performing the function of a chip carrier. In one example, it is in the form of a thin square of insulating material having contact pads arranged side by side along the four edges of both major surfaces. The chip is secured substantially centrally of the insulating material and connections are made from it to the contacts on both of the major surfaces. The carrier has a lower insulating layer (5) having contacts (6) extending over its under surface and carrying the chip (14) on its upper surface. An insulating spacer (8) carries further contacts (12). Electrical connections (16 and 18) are made to the contacts (6 and 12). An insulating cover (not shown) then closes off the hollow interior, locating on a shoulder (10). The contacts (12) thus provide the contacts on the upper surface of the finished construction. A single layer construction is also disclosed.

Abstract: A circuit assembly includes a mounting structure 10 having walls 11-13, 20 with conductor strips 19 running along the length of the structure. Plate members 14 carrying components such as integrated circuits 16 have conductive areas 18 which contact the conductor strips 19 when the members are inserted into the structure 10. The walls may include slots 15 into which the plate members 14 are slidably engaged. The support structure 10 thus provides physical support for the members 14 as well as electrical interconnection therebetween.Cooling arrangements for the assembly can include apertures 21 in the walls, and/or finning 22.

Abstract: A back-up electrical power supply module provides a back-up supply for a plug-in volatile electrical device such as a memory module. The memory module has a dual-in-line pins which engage socket openings of a standard dual-in-line circuit board connector. The back-up supply module is mounted on top of the memory module and has dual-in-line pins which contact corresponding ones of the pins of the memory module and corresponding socket openings. In this way the back-up supply module and the memory module can be unplugged as a unit and when unplugged, the back-up supply will maintain the contents of the volatile memory module intact.