Patents by Inventor Michael J. Ayton

Michael J. Ayton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9308365
    Abstract: A detachable electrode and anchor utilized with electrode leads and leadless medical implants that enable explantation of the electrode while leaving the anchor in place. The detachable electrode and anchor utilizes a detachable mechanism that detachably couples the electrode to the anchor. Embodiments do not require removal of existing scar tissue before explantation, which minimize chances of internal bleeding at the extraction site. Embodiments also minimize impact on the vein in which the electrode lead travels by eliminating use of a necessarily larger diameter sheath that is utilized around the electrode lead to remove the electrode lead and attached anchor.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: April 12, 2016
    Assignee: BIOTRONIK SE & CO. KG
    Inventors: Karl Nordstrom, Michael J. Ayton, Matthias Wenzel
  • Patent number: 9238145
    Abstract: A leadless implantable device delivery apparatus that enables testing of an implantation site before permanent implantation and enables secure attachment at the site while minimizing effects of the implantation procedure. Embodiments include a delivery sheath configured to accommodate a leadless implantable device, the leadless implantable device having an anchor that includes at least one projection configured to physically attach the anchor to tissue, such as heart tissue. In addition, embodiments include an adapter that resides within the delivery sheath and is configured to impart rotational force at the distal end of the adapter that is applied to the proximal end of the adapter to rotate the anchor associated with the implantable device.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: January 19, 2016
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Matthias Wenzel, Michael J. Ayton, Karl Nordstrom
  • Publication number: 20140148815
    Abstract: A leadless implantable device delivery apparatus that enables testing of an implantation site before permanent implantation and enables secure attachment at the site while minimizing effects of the implantation procedure. Embodiments include a delivery sheath configured to accommodate a leadless implantable device, the leadless implantable device having an anchor that includes at least one projection configured to physically attach the anchor to tissue, such as heart tissue. In addition, embodiments include an adapter that resides within the delivery sheath and is configured to impart rotational force at the distal end of the adapter that is applied to the proximal end of the adapter to rotate the anchor associated with the implantable device.
    Type: Application
    Filed: September 24, 2013
    Publication date: May 29, 2014
    Applicant: BIOTRONIK SE & Co. KG
    Inventors: Matthias Wenzel, Michael J. Ayton, Karl Nordstrom
  • Publication number: 20140148675
    Abstract: A detachable electrode and anchor utilized with electrode leads and leadless medical implants that enable explantation of the electrode while leaving the anchor in place. The detachable electrode and anchor utilizes a detachable mechanism that detachably couples the electrode to the anchor. Embodiments do not require removal of existing scar tissue before explantation, which minimize chances of internal bleeding at the extraction site. Embodiments also minimize impact on the vein in which the electrode lead travels by eliminating use of a necessarily larger diameter sheath that is utilized around the electrode lead to remove the electrode lead and attached anchor.
    Type: Application
    Filed: September 25, 2013
    Publication date: May 29, 2014
    Applicant: Biotronik SE & Co. KG
    Inventors: Karl Nordstrom, Michael J. Ayton, Matthias Wenzel
  • Patent number: 7511938
    Abstract: Filtering assembly for a feedthrough, for implantable medical devices, having operating conductive pin(s) and a ground conductive pin. The filtering assembly has: first insulating substrate, first conductive layer accommodated at first side of first insulating substrate and second conductive layer accommodated at second side of first insulating substrate opposing first side, first conductive layer comprises a conductive ground ring accommodated that surrounds the circumference of one end of the operating conductive pins and capacitive element(s), wherein each of the capacitive element(s) provides on the first side a connection to the operating conductive pin(s) and on the second side a connection to the ground ring, wherein the ground ring is connected to the ground pin, the second conductive layer comprises a ground plane providing connection to the ground ring of the first conductive layer and a connection to the ground pin.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: March 31, 2009
    Assignee: Biotronik CRM Patent AG
    Inventors: Ralph Elam, Philip J. Atkin, Michael J. Ayton, Marion Ronald LeCompte, Dennis Digby, Habib Homayoun
  • Publication number: 20080247117
    Abstract: Filtering assembly for a feedthrough, for implantable medical devices, having operating conductive pin(s) and a ground conductive pin. The filtering assembly has: first insulating substrate, first conductive layer accommodated at first side of first insulating substrate and second conductive layer accommodated at second side of first insulating substrate opposing first side, first conductive layer comprises a conductive ground ring accommodated that surrounds the circumference of one end of the operating conductive pins and capacitive element(s), wherein each of the capacitive element(s) provides on the first side a connection to the operating conductive pin(s) and on the second side a connection to the ground ring, wherein the ground ring is connected to the ground pin, the second conductive layer comprises a ground plane providing connection to the ground ring of the first conductive layer and a connection to the ground pin.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 9, 2008
    Inventors: Ralph Elam, Philip J. Atkin, Michael J. Ayton, Marion Ronald LeCompte, Dennis Digby, Habib Homayoun