Patents by Inventor Michael J. Baade

Michael J. Baade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10449373
    Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: October 22, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Katherine J. Bach, Van L. Snyder
  • Publication number: 20190314634
    Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
    Type: Application
    Filed: April 24, 2019
    Publication date: October 17, 2019
    Applicant: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Katherine J. Bach, Van L. Snyder
  • Patent number: 10300291
    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: May 28, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Michael J. Baade, Katherine J. Bach, Steven T. Deininger
  • Publication number: 20190143123
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Application
    Filed: January 15, 2019
    Publication date: May 16, 2019
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Patent number: 10286218
    Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: May 14, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Katherine J. Bach, Van L. Snyder
  • Publication number: 20190060653
    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
    Type: Application
    Filed: October 29, 2018
    Publication date: February 28, 2019
    Inventors: Michael J. Baade, Katherine J. Bach, Steven T. Deininger
  • Patent number: 10195448
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: February 5, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Patent number: 10143849
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: December 4, 2018
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Patent number: 10112053
    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: October 30, 2018
    Assignee: MEDTRONIC, INC.
    Inventors: Michael J. Baade, Katherine J. Bach, Steven T. Deininger
  • Publication number: 20180169419
    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
    Type: Application
    Filed: February 14, 2018
    Publication date: June 21, 2018
    Inventors: Michael J. Baade, Katherine J. Bach, Steven T. Deininger
  • Patent number: 9907965
    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: March 6, 2018
    Assignee: MEDTRONIC, INC.
    Inventors: Michael J. Baade, Katherine J. Bach, Steven T. Deininger
  • Publication number: 20180015290
    Abstract: Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 18, 2018
    Inventors: Steven T. Deininger, Michael J. Baade, Charles E. Peters
  • Publication number: 20170296830
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Application
    Filed: March 20, 2017
    Publication date: October 19, 2017
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Publication number: 20170157405
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Application
    Filed: February 20, 2017
    Publication date: June 8, 2017
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Publication number: 20170087359
    Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
    Type: Application
    Filed: April 18, 2012
    Publication date: March 30, 2017
    Applicant: Medtronic, Inc.
    Inventors: Steven T. Deininger, Michael J. Baade, Katherine J. Bach, Van L. Snyder
  • Publication number: 20170087358
    Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
    Type: Application
    Filed: April 18, 2012
    Publication date: March 30, 2017
    Applicant: Medtronic, Inc.
    Inventors: Steven T. Deininger, Michael J. Baade, Katherine J. Bach, Van L. Snyder
  • Patent number: 9597518
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: March 21, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Patent number: 9572993
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: February 21, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Publication number: 20160184594
    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 30, 2016
    Inventors: Michael J. Baade, Katherine J. Bach, Steven T. Deininger
  • Patent number: 8903473
    Abstract: A radiopaque marker for inclusion within an implantable medical device (IMD) may comprise one or more radiopaque articles selected from a predetermined set of radiopaque articles. The one or more radiopaque articles may be carried by an object formed of or including, a desiccant. The predetermined set of radiopaque articles may undergo a single qualification process that approves the use of any combination of one or more of the articles as a radiopaque marker within an IMD. This allows a potentially-limitless number of markers to be made available based on a single qualification process. The radiopaque marker may serve to provide information such as the make, model, and feature set of the device.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: December 2, 2014
    Assignee: Medtronic, Inc.
    Inventors: Charles R. Rogers, David D. Differding, John M. Gray, Michael J. Baade, Katherine J. Bach, Steven D. Byland, Steven T. Deininger