Patents by Inventor Michael J. Bellomo

Michael J. Bellomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5449297
    Abstract: An edge card interconnection system provides enhanced electrical interconnection between a module and a circuit board. Electrical contact length is minimized and deflection of the contacts is controlled as the system is configured to eliminate the need for the contacts to absorb module thickness tolerances. A latching mechanism is easily manipulated and provides significant protection to modules being installed/extracted. A hold-down mechanism facilitates enhanced engagement of the connector with the printed circuit board. An insulative connector portion includes a back-up spring that pushes an inserted module against a set of contacts. Deflection of the contacts is controlled by a wall of the connector portion that prohibits the module from deflecting the contacts beyond a preset amount. The back-up spring absorbs any tolerance(s) in board thickness.
    Type: Grant
    Filed: May 12, 1994
    Date of Patent: September 12, 1995
    Assignee: Augat Inc.
    Inventors: Michael J. Bellomo, Donald Santos, Wayne Johnson
  • Patent number: 5419712
    Abstract: An edge card interconnection system provides enhanced electrical interconnection between a module and a circuit board. Electrical contact length is minimized and deflection of the contacts is controlled as the system is configured to eliminate the need for the contacts to absorb module thickness tolerances. A latching mechanism is easily manipulated and provides significant protection to modules being installed/extracted. A hold-down mechanism facilitates enhanced engagement of the connector with the printed circuit board. An insulative connector portion includes a back-up spring that pushes an inserted module against a set of contacts. Deflection of the contacts is controlled by a wall of the connector portion that prohibits the module from deflecting the contacts beyond a preset amount. The back-up spring absorbs any tolerance(s) in board thickness.
    Type: Grant
    Filed: March 10, 1994
    Date of Patent: May 30, 1995
    Assignee: Augat Inc.
    Inventors: Michael J. Bellomo, Donald Santos, Wayne Johnson
  • Patent number: 5244403
    Abstract: The invention provides a socket for substrates such as single in-line memory modules, circuit boards, and similar components which are inserted into and rotated into fixed position on the socket. The socket housing includes end portions having improved structural integrity for externally mounting cooperative latch elements. The external mounting permits a greater variety of latch sizes and configurations to suit operational requirements. An exemplary latch is preferably metal and comprises a mounting collar having a compliant C-section which corresponds to a latch-receiving section or member on the socket housing, a detent for clasping a memory module, and a resilient section connected therebetween for biasing the detent so that it clasps the memory module in fixed position in the socket. The latch collar is mounted onto the cooperative section of the socket end portion, and the latch is thereby disposed exteriorly on the socket body.
    Type: Grant
    Filed: July 1, 1992
    Date of Patent: September 14, 1993
    Assignee: Augat Inc.
    Inventors: Gregory J. Smith, Wayne S. Alden, Mark E. Lewis, Michael J. Bellomo