Patents by Inventor Michael J. Bernhardt
Michael J. Bernhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230387353Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: ApplicationFiled: July 26, 2023Publication date: November 30, 2023Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Patent number: 11742458Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: GrantFiled: June 30, 2022Date of Patent: August 29, 2023Assignee: Micron Technology, Inc.Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Publication number: 20220336705Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Patent number: 11411139Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein, in several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: GrantFiled: July 7, 2020Date of Patent: August 9, 2022Assignee: Micron Technology, Inc.Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Publication number: 20220123190Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.Type: ApplicationFiled: December 27, 2021Publication date: April 21, 2022Inventor: Michael J. Bernhardt
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Patent number: 11211537Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.Type: GrantFiled: April 30, 2020Date of Patent: December 28, 2021Assignee: Micron Technology, Inc.Inventor: Michael J. Bernhardt
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Publication number: 20200335665Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein, in several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: ApplicationFiled: July 7, 2020Publication date: October 22, 2020Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Publication number: 20200274043Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.Type: ApplicationFiled: April 30, 2020Publication date: August 27, 2020Inventor: Michael J. Bernhardt
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Patent number: 10756236Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: GrantFiled: August 17, 2018Date of Patent: August 25, 2020Assignee: Micron Technology, Inc.Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Patent number: 10644211Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.Type: GrantFiled: November 16, 2017Date of Patent: May 5, 2020Assignee: Micron Technology, Inc.Inventor: Michael J. Bernhardt
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Patent number: 10629652Abstract: Embodiments of the present disclosure describe techniques and configurations for a memory device comprising a memory array having a plurality of wordlines disposed in a memory region of a die. Fill regions may be disposed between respective pairs of adjacent wordlines of the plurality of wordlines. The fill regions may include a first dielectric layer and a second dielectric layer disposed on the first dielectric layer. The first dielectric layer may comprise organic (e.g., carbon-based) spin-on dielectric material (CSOD). The second dielectric layer may comprise a different dielectric material than the first dielectric layer, such as, for example, inorganic dielectric material. Other embodiments may be described and/or claimed.Type: GrantFiled: November 15, 2018Date of Patent: April 21, 2020Assignee: Intel CorporationInventors: Michael J. Bernhardt, Yudong Kim, Denzil S. Frost, Tuman Earl Allen, III, Kevin Lee Baker, Kolya Yastrebenetsky, Ronald Allen Weimer
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Patent number: 10607695Abstract: Embodiments of the present disclosure are directed towards techniques to provide structural integrity for a memory device comprising a memory array. In one embodiment, the device may comprise a memory array having at least a plurality of wordlines disposed in a memory region of a die, and a first fill layer deposited between adjacent wordlines of the plurality of wordlines in the memory region, to provide structural integrity for the memory array. At least a portion of a periphery region of the die adjacent to the memory region may be substantially filled with a second fill layer that is different than the first fill layer. Other embodiments may be described and/or claimed.Type: GrantFiled: September 6, 2016Date of Patent: March 31, 2020Assignee: INTEL CORPORATIONInventor: Michael J. Bernhardt
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Publication number: 20190206942Abstract: Embodiments of the present disclosure describe techniques and configurations for a memory device comprising a memory array having a plurality of wordlines disposed in a memory region of a die. Fill regions may be disposed between respective pairs of adjacent wordlines of the plurality of wordlines. The fill regions may include a first dielectric layer and a second dielectric layer disposed on the first dielectric layer. The first dielectric layer may comprise organic (e.g., carbon-based) spin-on dielectric material (CSOD). The second dielectric layer may comprise a different dielectric material than the first dielectric layer, such as, for example, inorganic dielectric material. Other embodiments may be described and/or claimed.Type: ApplicationFiled: November 15, 2018Publication date: July 4, 2019Inventors: Michael J. Bernhardt, Yudong Kim, Denzil S. Frost, Tuman Earl Allen, III, Kevin Lee Baker, Kolya Yastrebenetsky, Ronald Allen Weimer
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Publication number: 20190057736Abstract: Embodiments of the present disclosure are directed towards techniques to provide structural integrity for a memory device comprising a memory array. In one embodiment, the device may comprise a memory array having at least a plurality of wordlines disposed in a memory region of a die, and a first fill layer deposited between adjacent wordlines of the plurality of wordlines in the memory region, to provide structural integrity for the memory array. At least a portion of a periphery region of the die adjacent to the memory region may be substantially filled with a second fill layer that is different than the first fill layer. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 6, 2016Publication date: February 21, 2019Inventor: Michael J. BERNHARDT
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Publication number: 20180374993Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: ApplicationFiled: August 17, 2018Publication date: December 27, 2018Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Patent number: 10134809Abstract: Embodiments of the present disclosure describe techniques and configurations for a memory device comprising a memory array having a plurality of wordlines disposed in a memory region of a die. Fill regions may be disposed between respective pairs of adjacent wordlines of the plurality of wordlines. The fill regions may include a first dielectric layer and a second dielectric layer disposed on the first dielectric layer. The first dielectric layer may comprise organic (e.g., carbon-based) spin-on dielectric material (CSOD). The second dielectric layer may comprise a different dielectric material than the first dielectric layer, such as, for example, inorganic dielectric material. Other embodiments may be described and/or claimed.Type: GrantFiled: June 2, 2017Date of Patent: November 20, 2018Assignee: INTEL CORPORATIONInventors: Michael J. Bernhardt, Yudong Kim, Denzil S. Frost, Tuman Earl Allen, Kevin Lee Baker, Kolya Yastrebenetsky, Ronald Allen Weimer
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Patent number: 10084114Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.Type: GrantFiled: May 9, 2016Date of Patent: September 25, 2018Assignee: Micron Technology, Inc.Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
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Publication number: 20180090651Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.Type: ApplicationFiled: November 16, 2017Publication date: March 29, 2018Inventor: Michael J. Bernhardt
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Patent number: 9842976Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.Type: GrantFiled: September 1, 2016Date of Patent: December 12, 2017Assignee: Micron Technology, Inc.Inventor: Michael J. Bernhardt
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Publication number: 20170271412Abstract: Embodiments of the present disclosure describe techniques and configurations for a memory device comprising a memory array having a plurality of wordlines disposed in a memory region of a die. Fill regions may be disposed between respective pairs of adjacent wordlines of the plurality of wordlines. The fill regions may include a first dielectric layer and a second dielectric layer disposed on the first dielectric layer. The first dielectric layer may comprise organic (e.g., carbon-based) spin-on dielectric material (CSOD). The second dielectric layer may comprise a different dielectric material than the first dielectric layer, such as, for example, inorganic dielectric material. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 2, 2017Publication date: September 21, 2017Inventors: Michael J. Bernhardt, Yudong Kim, Denzil S. Frost, Tuman Earl Allen, III, Kevin Lee Baker, Kolya Yastrebenetsky, Ronald Allen Weimer