Patents by Inventor Michael J. Bettinger
Michael J. Bettinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7677429Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: August 22, 2008Date of Patent: March 16, 2010Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Publication number: 20080302862Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: ApplicationFiled: August 22, 2008Publication date: December 11, 2008Applicant: MICRON TECHNOLOGY, INC.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 7416107Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: October 7, 2005Date of Patent: August 26, 2008Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 6966480Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: July 22, 2003Date of Patent: November 22, 2005Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Publication number: 20040056072Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: ApplicationFiled: July 22, 2003Publication date: March 25, 2004Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 6655535Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: April 25, 2002Date of Patent: December 2, 2003Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 6595406Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: May 23, 2002Date of Patent: July 22, 2003Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Publication number: 20020134819Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: ApplicationFiled: May 23, 2002Publication date: September 26, 2002Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Publication number: 20020124396Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: ApplicationFiled: April 25, 2002Publication date: September 12, 2002Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 6439450Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: August 27, 2001Date of Patent: August 27, 2002Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 6398043Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: June 4, 2001Date of Patent: June 4, 2002Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Publication number: 20020023943Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: ApplicationFiled: August 27, 2001Publication date: February 28, 2002Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 6311890Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: August 28, 2000Date of Patent: November 6, 2001Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 6279758Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: August 30, 2000Date of Patent: August 28, 2001Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 6158647Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.Type: GrantFiled: September 29, 1998Date of Patent: December 12, 2000Assignee: Micron Technology, Inc.Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
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Patent number: 6158595Abstract: A circuit board carrier and method of using the same. The circuit board carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the circuit board carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: October 19, 1999Date of Patent: December 12, 2000Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 5992649Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: January 5, 1999Date of Patent: November 30, 1999Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 5988619Abstract: This invention relates to a circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: April 2, 1998Date of Patent: November 23, 1999Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 5911329Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.Type: GrantFiled: April 30, 1996Date of Patent: June 15, 1999Assignee: Micron Technology, Inc.Inventors: James M. Wark, Michael J. Bettinger
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Patent number: 5831504Abstract: A magnetic actuator design and method of use is provided that generally reduces problems associated with conventional actuators and can be specifically employed to increase the accuracy of actuator type precision operations, such as surface mounted electrical component placement, die and attach tooling movements, and tape and reel part storage tooling. The actuator includes a housing, a stem slidably disposed and having a rest position within the housing, a first magnetic portion attached to the stem and, a second magnetic portion attached to the housing, the second magnetic portion being of sufficient strength and oriented to exert a generally predetermined force on said first magnetic portion sufficient to resist displacement of said stem from said rest position.Type: GrantFiled: April 23, 1997Date of Patent: November 3, 1998Assignee: Micron Technology, Inc.Inventors: John G. Piper, Michael J. Bettinger