Patents by Inventor Michael J. Bossio

Michael J. Bossio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of refining solder materials
    Patent number: 9666547
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: May 30, 2017
    Assignee: Honeywell International Inc.
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • METHOD OF REFINING SOLDER MATERIALS
    Publication number: 20100206133
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: April 28, 2010
    Publication date: August 19, 2010
    Applicant: Honeywell International Inc.
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • Methods of refining lead-containing materials
    Patent number: 7521286
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: April 21, 2009
    Assignee: Honeywell International Inc.
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials
    Publication number: 20040065954
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 8, 2004
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint