Patents by Inventor Michael J Conover

Michael J Conover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-component transfer systems, methods, and devices
    Patent number: 11246251
    Abstract: A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: February 8, 2022
    Assignee: Seagate Technology LLC
    Inventors: Michael J Conover, Javier I Guzman, I-Fei Tsu, Joseph J Schobel
  • Micro-component batch transfer systems, methods, and devices
    Patent number: 10923378
    Abstract: A method for transferring components from a transfer head to a receiving substrate is disclosed. The method includes monitoring signals indicative of a pitch mismatch between locations on the transfer head and locations on the receiving substrate and actuating at least one actuator based at least in part on the monitored signals to reduce the mismatch of the pitch of the locations on the transfer head and the locations on the receiving substrate.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: February 16, 2021
    Assignee: Seagate Technology LLC
    Inventors: Javier I Guzman, I-Fei Tsu, Michael J Conover, Declan Macken
  • MICRO-COMPONENT BATCH TRANSFER SYSTEMS, METHODS, AND DEVICES
    Publication number: 20200365439
    Abstract: A method for transferring components from a transfer head to a receiving substrate is disclosed. The method includes monitoring signals indicative of a pitch mismatch between locations on the transfer head and locations on the receiving substrate and actuating at least one actuator based at least in part on the monitored signals to reduce the mismatch of the pitch of the locations on the transfer head and the locations on the receiving substrate.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 19, 2020
    Inventors: Javier I Guzman, I-Fei Tsu, Michael J Conover, Declan Macken
  • MICRO-COMPONENT TRANSFER SYSTEMS, METHODS, AND DEVICES
    Publication number: 20200352070
    Abstract: A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.
    Type: Application
    Filed: May 2, 2019
    Publication date: November 5, 2020
    Inventors: Michael J Conover, Javier I Guzman, I-Fei Tsu, Joseph J Schobel