Abstract: A heat exchanger within an insulated enclosure receives primary refrigerant at a high pressure and cools the primary refrigerant using a secondary refrigerant from a secondary refrigeration system. An expansion unit within the insulated enclosure receives the primary refrigerant at the high pressure from the heat exchanger and discharges the primary refrigerant at a low pressure. A supply line delivers the primary refrigerant at the low pressure to the load and a return line returns the primary refrigerant from the load to the primary refrigeration system. A system control unit controls operation of at least one of the primary refrigeration system and the secondary refrigeration system to provide a variable refrigeration capacity to the load based on at least one of: a pressure of the primary refrigerant delivered to the load, and at least one temperature of the load.

Abstract: A cryopump includes a refrigerator with at least first and second stages. A radiation shield surrounds the second stage and is in thermal contact with the first stage. The radiation shield includes a drain hole to permit cryogenic fluid to traverse through the drain hole during regeneration. The cryopump also includes a primary pumping surface supporting adsorbent in thermal contact with the second stage. The second stage array assembly includes a primary condensing surface, protected surfaces having adsorbent, and non-primary condensing surfaces. A baffle is disposed over the drain hole. The baffle redirects gas from an annular space disposed between the radiation shield and the vacuum vessel that attempts to traverse through the drain hole to prevent the gas from condensing on a non-primary condensing surface. The baffle directs gas to condense on the primary condensing surface.

Abstract: A refrigerator system or cryopump includes a first refrigerator having at least first and second stages, and a second refrigerator. A thermal coupling between the first stage of the first refrigerator and a cold end of the second refrigerator is restricted to maintain a temperature difference between the cold end of the second refrigerator and the first stage of the first refrigerator. The refrigerator system or cryopump also includes a radiation shield in thermal contact with the cold end of the second refrigerator, and a condensing surface, spaced from and surrounded by the radiation shield, and in thermal contact with a second stage, e.g., coldest stage, of the first refrigerator. The restricted thermal coupling can be configured to balance the cooling load on the two refrigerators.

Abstract: A heat exchanger within an insulated enclosure receives primary refrigerant at a high pressure and cools the primary refrigerant using a secondary refrigerant from a secondary refrigeration system. An expansion unit within the insulated enclosure receives the primary refrigerant at the high pressure from the heat exchanger and discharges the primary refrigerant at a low pressure. A supply line delivers the primary refrigerant at the low pressure to the load and a return line returns the primary refrigerant from the load to the primary refrigeration system. A system control unit controls operation of at least one of the primary refrigeration system and the secondary refrigeration system to provide a variable refrigeration capacity to the load based on at least one of: a pressure of the primary refrigerant delivered to the load, and at least one temperature of the load.

Abstract: In accordance with an embodiment of the invention, there is provided a system for cooling a load.

Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.

Abstract: A refrigerator system or cryopump includes a first refrigerator having at least first and second stages, and a second refrigerator. A thermal coupling between the first stage of the first refrigerator and a cold end of the second refrigerator is restricted to maintain a temperature difference between the cold end of the second refrigerator and the first stage of the first refrigerator. The refrigerator system or cryopump also includes a radiation shield in thermal contact with the cold end of the second refrigerator, and a condensing surface, spaced from and surrounded by the radiation shield, and in thermal contact with a second stage, e.g., coldest stage, of the first refrigerator. The restricted thermal coupling can be configured to balance the cooling load on the two refrigerators.

Abstract: A refrigerator system or cryopump includes a first refrigerator having at least first and second stages, and a second refrigerator. A thermal coupling between the first stage of the first refrigerator and a cold end of the second refrigerator is restricted to maintain a temperature difference between the cold end of the second refrigerator and the first stage of the first refrigerator. The refrigerator system or cryopump also includes a radiation shield in thermal contact with the cold end of the second refrigerator, and a condensing surface, spaced from and surrounded by the radiation shield, and in thermal contact with a second stage, e.g., coldest stage, of the first refrigerator. The restricted thermal coupling can be configured to balance the cooling load on the two refrigerators.

Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.

Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.

Abstract: A cryopump system includes a cryopump having a first cooling stage and a second cooling stage connected to the first cooling stage, the second cooling stage including a gas adsorber having a hydrogen adsorbing capacity of at least about 2 standard liters. The thermal storage capacity of the second cooling stage is sufficient to enable control of hydrogen pressure within the cryopump to satisfy ignition safety limits and limits on hydrogen flow rate in an exhaust line to be within limits of an abatement system to be coupled to the cryopump, upon warming of the second cooling stage during regeneration of up to a fully loaded cryopump.

Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.

Abstract: A cryopump system includes a cryopump having a first cooling stage and a second cooling stage connected to the first cooling stage, the second cooling stage including a gas adsorber having a hydrogen adsorbing capacity of at least about 2 standard liters. The thermal storage capacity of the second cooling stage is sufficient to enable control of hydrogen pressure within the cryopump to satisfy ignition safety limits and limits on hydrogen flow rate in an exhaust line to be within limits of an abatement system to be coupled to the cryopump, upon warming of the second cooling stage during regeneration of up to a fully loaded cryopump.

Abstract: In accordance with an embodiment of the invention, there is provided a system for cooling a load.

Abstract: A cluster tool has a transfer chamber, and a load lock chamber. An adaptor is configured to be coupled between the transfer chamber and the load lock chamber. The adaptor has an adaptor housing with an interior space including an entrance with a first valve and an exit with a second valve. The adaptor housing forms a substrate path through the interior space. The first valve connects the interior space and the load lock chamber. The second valve connects the interior space and the transfer chamber. A cryogenic surface is associated with the adaptor. Other pumps can be associated with the adaptor, such as, for example, a turbo pump, or water vapor pump. The cryogenic surface is configured to selectively evacuate the interior space. A wafer is adapted to be moved through the first valve and through the adaptor housing along the path. The wafer is moved through the exit and into the transfer chamber once the second valve is opened. This adaptor can be applied to the process chamber as well as the load lock.

Abstract: A cluster tool has a transfer chamber, and a load lock chamber. An adaptor is configured to be coupled between the transfer chamber and the load lock chamber. The adaptor has an adaptor housing with an interior space including an entrance with a first valve and an exit with a second valve. The adaptor housing forms a substrate path through the interior space. The first valve connects the interior space and the load lock chamber. The second valve connects the interior space and the transfer chamber. A cryogenic surface is associated with the adaptor. Other pumps can be associated with the adaptor, such as, for example, a turbo pump, or water vapor pump. The cryogenic surface is configured to selectively evacuate the interior space. A wafer is adapted to be moved through the first valve and through the adaptor housing along the path. The wafer is moved through the exit and into the transfer chamber once the second valve is opened. This adaptor can be applied to the process chamber as well as the load lock.

Abstract: A cryopump includes a refrigerator with at least first and second stages. A radiation shield surrounds the second stage and is in thermal contact with the first stage. The radiation shield includes a drain hole to permit cryogenic fluid to traverse through the drain hole during regeneration. The cryopump also includes a primary pumping surface supporting adsorbent in thermal contact with the second stage. The second stage array assembly includes a primary condensing surface, protected surfaces having adsorbent, and non-primary condensing surfaces. A baffle is disposed over the drain hole. The baffle redirects gas from an annular space disposed between the radiation shield and the vacuum vessel that attempts to traverse through the drain hole to prevent the gas from condensing on a non-primary condensing surface. The baffle directs gas to condense on the primary condensing surface.

Abstract: An electronic controller maintains the operating temperature of a cryopump by controlling a heater coupled to the cryopump. The heater is coupled to a cryopumping surface of the cryopump. The controller can control the operation of the heater in response to feedback from temperature sensors coupled to the cryopump. The controller can cause the heater to shut-off if a temperature sensor reads out of its normal temperature range.

Abstract: An electronic controller is used to control a vacuum gauge in a vacuum system. The electronic controller may be coupled to a vacuum pump in the vacuum system. Preferably, the vacuum pump is a cryopump. The electronic controller determines whether there is a potentially dangerous condition present in the vacuum system. A potentially dangerous condition may be present, for example, if there is a sufficient amount of gas in the vacuum pump to ignite. If the vacuum pump is filed with inert gas, such as nitrogen, then the potentially dangerous condition is not present. The potentially dangerous condition is present when the temperature of the vacuum pump is above a temperature setpoint, such as 20K. The electronic controller responds to a potentially dangerous condition by preventing the vacuum gauge from being turned on.

Abstract: In a cryogenic vacuum pump, after determining that a power fail recovery mode is on, and that the temperature is below a setpoint, the cryopump is automatically cooled. If the power fail recovery mode is on, and the temperature is above the setpoint, a regeneration cycle is started automatically. If the power fail recovery mode is off, the cryopump may be maintained in an off state. When a command to turn on a pressure sensing thermocouple (TC) gauge is received, the TC gauge is turned on only if there is not a sufficient amount of gas to ignite. When a command to turn on a roughing valve is received, an additional command must be received before the roughing valve is turned on. When a temperature-sensing diode is faulty, temperature control is automatically turned off. During a regeneration cycle, a purge test is performed. If the purge test passes, heaters are turned on. If the purge test fails, the heaters are turned on only if the temperature reaches a threshold within a predetermined period.