Patents by Inventor MICHAEL J. FEDOR

MICHAEL J. FEDOR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to control the temperature of a high powered computing component through a liquid cooled heatsink responsive to an increase in the thermal value
    Patent number: 9122737
    Abstract: Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: September 1, 2015
    Assignee: International Business Machines Corporation
    Inventors: David L. Darrington, Adam C. Emerich, Michael J. Fedor, Raymond K. Shokes
  • Calculating a thermal value to control the flow of liquid through the liquid cooled heatsink which is in thermal communication with the high powered computing component
    Patent number: 9122736
    Abstract: Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: September 1, 2015
    Assignee: International Business Machines Corporation
    Inventors: David L. Darrington, Adam C. Emerich, Michael J. Fedor, Raymond K. Shokes
  • MONITORING THE TEMPERATURE OF A HIGH POWERED COMPUTING COMPONENT
    Publication number: 20140201557
    Abstract: Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
    Type: Application
    Filed: January 11, 2013
    Publication date: July 17, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: DAVID L. DARRINGTON, ADAM C. EMERICH, MICHAEL J. FEDOR, RAYMOND K. SHOKES
  • MONITORING THE TEMPERATURE OF A HIGH POWERED COMPUTING COMPONENT
    Publication number: 20140201558
    Abstract: Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
    Type: Application
    Filed: February 13, 2013
    Publication date: July 17, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: DAVID L. DARRINGTON, ADAM C. EMERICH, MICHAEL J. FEDOR, RAYMOND K. SHOKES