Abstract: A system includes an implantable medical device and processing circuitry. The implantable medical device includes an accelerometer and sensing circuitry. The processing circuitry obtains, during a calibration period, a first motion signal from the accelerometer. The processing circuitry determines a motion threshold based on the first motion signal. The motion threshold relates to an amount of motion of the patient that is significant for treatment of the health condition of the patient. The processing circuitry obtains, during a collection period, a second motion signal from the accelerometer. Responsive to the second motion signal satisfying the motion threshold, the processing circuitry stores data related to the treatment of the health condition of the patient.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.