Abstract: A system for gasifying a carbonaceous feedstock, such as municipal waste, to generate power includes a devolatilization reactor that creates char from the feedstock and a gasifier that creates a product gas from both the char and from volatiles released when devolatilizing the feedstock. The product gas is reacted in a fuel cell to create electrical energy and process heat. The process heat is used to heat the devolatilization reactor and the gasifier. The gasifier comprises a plurality of configurable circuits that can each be tuned to meet the individual needs of the char material being gasified.

Abstract: A system for gasifying a carbonaceous feedstock, such as municipal waste, to generate power includes a devolatilization reactor that creates char from the feedstock and a gasifier that creates a product gas from both the char and from volatiles released when devolatilizing the feedstock. The product gas is reacted in a fuel cell to create electrical energy and process heat. The process heat is used to heat the devolatilization reactor and the gasifier. The gasifier comprises a plurality of configurable circuits that can each be tuned to meet the individual needs of the char material being gasified.

Abstract: Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.

Abstract: Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.

Abstract: An assembly includes a toroidal induction component, a potting cup, and potting material. The toroidal induction component includes a conductive winding, where at least ends of the conductive winding define a lead set of the toroidal induction component. The potting cup is configured to accept the toroidal induction component and its lead set. Techniques for forming the assembly are also described.

Abstract: Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.

Abstract: A holding device comprises a clip, and a flexible cord. The cord is looped upon itself and its ends are received in a trough on a stem of the clip. The trough has laterally spaced tabs which are crimped over the ends of the cord to secure the cord to the clip. A metal tube is crimped over the trough and the cord ends, and shrink tubing is fitted over the metal tube.