Abstract: A wire termination system includes a heat applicator device to apply resistive heating to a specific connector pin of an electrical connector for the soldering of a wire to the connector pin. In operation, a wire of a cable is inserted into an interior cavity of the connector pin and resistive heating is applied to the connector pin resulting in the melting of solder contained within the interior cavity. Upon stoppage of the resistive heating by the heat applicator device, the solder within the interior cavity of the connector pin solidifies about the wire to form an electrical connection between the wire and the connector pin. The heat applicator device may then be repositioned to apply resistive heating to each additional connector pin of the electrical connector until all wires of the cable are soldered to their corresponding connector pins on the electrical connector.