Abstract: A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201,203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).

Abstract: In a bending machine, metal strip (42) is bent by a sequence of steps including longitudinal advance of the strip (42) alternating with bending of the strip by a movable tool (18) which engages and deflects the strip when the latter is restrained against longitudinal movement. Provision is made for checking or inspecting the permanent angular deformation of each bend applied to the strip, to take account of the tendency of the metal strip to spring back after bending. Compensation for spring-back is achieved by use of a previously described characteristic relating displacement of the bending tool to the resultant permanent angle of bend applied to the strip. Further compensation is provided to remove an error which can arise if the bending tool is movable along a line of action spaced from the point of bending of the strip by an amount greater than the incremental advance of the strip.

Abstract: An apparatus for metering required proportions of different fluid ingredients to make a required mixture (e.g. a colored paint) includes a rack of storage containers for the ingredients, each provided with a valve-controlled outlet and a receiving container mounted on a weighing device which is presentable to a chosen sequence of storage containers in turn to receive the required contribution from each. Metering of the necessary ingredient additions is effected automatically by a valve actuator carried by the support for the weighing device. Data processing control to optimize operation is described.