Patents by Inventor Michael J. Kocin

Michael J. Kocin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6865690
    Abstract: A power module for a CNI avionics system includes a rechargeable back-up battery (17) and a battery charger (9) in a back-up battery channel, a power conversion unit (11, 25, 27 and 29) in a power conditioning channel, and a semiconductor switch (23) for selectively coupling either the output of the power conditioning channel unit or the back-up battery channel through to the module output (24) and the electronics of external LRM's of the cryptographic section of the CNI avionics system, and a microcontroller (14) for controlling voltages and spurious signal emanations. Sensors (51, 52, 54 & 55) provide information to the microcontroller. The microcontroller senses the state of prime power, current draw on the cryptographic devices and adjusts power output between the battery and power supply in real time.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: March 8, 2005
    Assignee: Northrop Grumman Corporation
    Inventor: Michael J. Kocin
  • Patent number: 6721559
    Abstract: A system for air-ground (120) and air-air (122) communications wherein a VHF data radio (204) is coupled to a high-speed bus (304). The VHF data radio complies with the ARINC 716/750 standard and is accessible via the bus using a programmable interface (306). A communications management unit (208) can also be coupled to the high-speed bus, which communicates with the VHF data radio via the bus according to the programmable interface.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: April 13, 2004
    Assignee: Northrop Grumman Corporation
    Inventors: Michael J. Kocin, Michael E. Campbell
  • Patent number: 6614325
    Abstract: A Printed Circuit Board (PCB) (30, 70, 102) and method of manufacturing same. The PCB (30, 70, 102) includes an embedded shielded conductor structure comprising a dielectric layer (42) disposed over a first conductor (40, 80, 84), and a second conductor (38, 78, 82) proximate and coupled to said first conductor (40, 80, 84) being disposed over said dielectric layer (42). The first (40, 80, 84) and second (38, 78, 82) conductors are juxtaposed to form a broadside coupled stripline. A first low noise ground layer (54, 94) is disposed under said first conductor (40, 80, 84), and a second low noise ground layer (52, 92) is disposed over said second conductor (38, 78, 82), these low noise ground layers typically being coupled to chassis ground. RF (32, 72) and digital (34, 74) portions of the PCB (30, 70, 102) are separated and isolated by a vertical ground shield (36, 76). The use of heavy, bulky RF connectors and cables may be eliminated or reduced.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: September 2, 2003
    Assignee: Northrop Grumman Corporation
    Inventor: Michael J. Kocin
  • Publication number: 20020199131
    Abstract: A power module for a CNI avionics system includes a rechargeable back-up battery (17) and a battery charger (9) in a back-up battery channel, a power conversion unit (11, 25, 27 and 29) in a power conditioning channel, and a semiconductor switch (23) for selectively coupling either the output of the power conditioning channel unit or the back-up battery channel through to the module output (24) and the electronics of external LRM's of the cryptographic section of the CNI avionics system, and a microcontroller (14) for controlling voltages and spurious signal emanations. Sensors (51, 52, 54 & 55) provide information to the microcontroller. The microcontroller senses the state of prime power, current draw on the cryptographic devices and adjusts power output between the battery and power supply in real time.
    Type: Application
    Filed: June 21, 2001
    Publication date: December 26, 2002
    Inventor: Michael J. Kocin
  • Publication number: 20020090844
    Abstract: A backplane connection system (1) is formed of a primary mother board (3) and a plurality of daughter board backplanes (5, 7, & 9) that electrically interconnect (18, 20, 24 & 26) to and populate the primary mother board. The primary mother board contains the electrical connections to interconnect amongst the various daughter board backplanes. Each daughter board backplane includes connectors (10A, 10B, 10C, 10D, 16A, 16B, 16C, 16D & 28) for connecting to a line replaceable module. Preferably, the functional portions of an integrated electronic system are segregated amongst the daughter board backplanes, allowing each functional portion to reside on or be associated with a respective one of the daughter board backplanes.
    Type: Application
    Filed: January 9, 2001
    Publication date: July 11, 2002
    Inventor: Michael J. Kocin
  • Patent number: 4689721
    Abstract: A dual printed circuit board module having two printed circuit boards mounted in an inwardly facing relationship on two thermal frame members that also function as structural and enclosing members. A connector mounted between and at one edge of the thermal frame members serves to establish electrical connections between the circuit boards and a backplane circuit panel to which the boards are to be connected. A flexible interconnect circuit, located near the same edge of the boards as the backplane connector, is used both to connect the boards to the connector and to provide board-to-board connections independently of the connector. This arrangement greatly facilitates assembly and testing of the module, reduces signal path lengths, and enhances the structural and thermal integrity of the module.
    Type: Grant
    Filed: April 7, 1986
    Date of Patent: August 25, 1987
    Assignee: TRW Inc.
    Inventors: Milton F. Damerow, Michael J. Kocin