Abstract: A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.

Abstract: The present invention is directed at a bin lifting and weighing assembly comprising a bin lifting mechanism having means for engaging and lifting a bin; means for mounting the bin lifting mechanism against a structure; a load cell, mounted against the structure; for measuring a weight of the bins; wherein the means for mounting the bin lifting mechanism allows only a single degree of freedom such that the load cell remains in parallel with the structure.

Abstract: A disc saw felling head has a window in a sidewall of the head through which chips are discharged in a tangent plane and a discharge chute over the window. The chute has a top wall and inner and outer sidewalls shaped so that chips exiting the head through the window are directed along a chip path which is generally parallel to the tangent plane and first turns further rearward and then turns outward through a lateral discharge opening in the chute.