Patents by Inventor Michael J. Mencik

Michael J. Mencik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Split conductive pad for mounting components to a circuit board
    Patent number: 5425647
    Abstract: A component is mounted to a circuit board using two spaced apart conductive pad portions that make electrical contact with a terminal of the component. The space between the conductive pad portions provides an additional path through which a cleaning solution and debris can flow.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: June 20, 1995
    Assignee: AlliedSignal Inc.
    Inventors: Michael J. Mencik, Michael E. Jarboe
  • Method for mounting components to a circuit board
    Patent number: 5163605
    Abstract: A component is mounted to a circuit board by covering a section of the board's conductive pads with a nonconductive mask. It is also possible to plate additional conductive material onto the pads before applying the mask. The component's contacts are soldered to the uncovered sections of the pads or plating.
    Type: Grant
    Filed: April 30, 1992
    Date of Patent: November 17, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Michael J. Mencik, Richard P. Lambert, Jr., Helmut Matheis, Donald K. Swenson