Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

Abstract: A buoyant pool lounge chair frame and buoyant pool lounge chair using the same are disclosed. In one embodiment of the buoyant pool lounge chair for supporting a person while the buoyant pool chair is floating in water, frame members collectively form an open chair frame including a back frame and leg frame pivotally coupled thereto. Buoyant cushions are attached to the frame members to form a chair seat, a backrest, and a leg rest. A pair of rear pivotal coupling and clutch assemblies are coupled to the seat frame and to the back frame to adjust and fix the angle of recline of the back frame relative to the seat frame. Similarly, a pair of front pivotal coupling and clutch assemblies coupled to the leg frame and to the back frame to adjust and fix the angle of extension of the leg frame relative to the seat frame.

Abstract: An air hose includes a corrugated flexible hose. The air hose also includes a first hose end section mechanically coupled to the corrugated flexible hose. The first hose end section includes a pressure sensor communicatively coupled to a warming unit. The first hose end section is configured to releasably couple to a pneumatic convective device. The air hose also includes a second hose end section mechanically coupled to the corrugated flexible hose. The second hose end section is configured to couple to the warming unit.

Abstract: Embodiments herein relate to breath analysis system. In an embodiment, a gas measurement device is included having a housing defining an interior volume. The housing can include a fluid ingress port, a fluid egress port, a bottom wall, and a circuit board disposed within the interior volume. The circuit board can include a first side and a second side, where the first side of the circuit board faces inward toward the interior volume. The circuit board can include a plurality of gas sensors disposed on the first side of the circuit board and a plurality of conductive pads disposed on the second side of the circuit board, wherein a plurality of electrical contacts contact the conductive pads when the circuit board is seated within the housing. Other embodiments are also included herein.

Abstract: Methods for configurable and proactive application diagnostics and recovery are performed by systems and devices. A diagnostics manager determines diagnostics packages corresponding to problems described in client device diagnostics requests. Session identifiers are generated and returned with diagnostics identifiers to clients which then provide the session identifiers and diagnostics identifiers to a service manager for session initiation. Diagnostics packages are located, retrieved, and provided back to the client by the service manager that invokes a client-side engine to execute diagnostics packages. Results are provided to the diagnostics system which determines additional packages to be executed by the engine during the same diagnostics session. Further, device-specific tokens are acquired by client devices which execute local diagnostic packages and acquire remote diagnostic packages for execution in the same session.

Abstract: Methods for configurable and proactive application diagnostics and recovery are performed by systems and devices. A diagnostics manager determines diagnostics packages corresponding to problems described in client device diagnostics requests. Session identifiers are generated and returned with diagnostics identifiers to clients which then provide the session identifiers and diagnostics identifiers to a service manager for session initiation. Diagnostics packages are located, retrieved, and provided back to the client by the service manager that invokes a client-side engine to execute diagnostics packages. Results are provided to the diagnostics system which determines additional packages to be executed by the engine during the same diagnostics session. Further, device-specific tokens are acquired by client devices which execute local diagnostic packages and acquire remote diagnostic packages for execution in the same session.

Abstract: Methods for configurable and proactive application diagnostics and recovery are performed by systems and devices. A diagnostics manager determines diagnostics packages corresponding to problems described in client device diagnostics requests. Session identifiers are generated and returned with diagnostics identifiers to clients which then provide the session identifiers and diagnostics identifiers to a service manager for session initiation. Diagnostics packages are located, retrieved, and provided back to the client by the service manager that invokes a client-side engine to execute diagnostics packages. Results are provided to the diagnostics system which determines additional packages to be executed by the engine during the same diagnostics session. Further, device-specific tokens are acquired by client devices which execute local diagnostic packages and acquire remote diagnostic packages for execution in the same session.

Abstract: Methods for configurable and proactive application diagnostics and recovery are performed by systems and devices. A diagnostics manager determines diagnostics packages corresponding to problems described in client device diagnostics requests. Session identifiers are generated and returned with diagnostics identifiers to clients which then provide the session identifiers and diagnostics identifiers to a service manager for session initiation. Diagnostics packages are located, retrieved, and provided back to the client by the service manager that invokes a client-side engine to execute diagnostics packages. Results are provided to the diagnostics system which determines additional packages to be executed by the engine during the same diagnostics session. Further, device-specific tokens are acquired by client devices which execute local diagnostic packages and acquire remote diagnostic packages for execution in the same session.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: A modular industrial drive system includes a base that receives one or more control modules as a face template. The control modules provide a set of functionalities to the drive system, and the face template serves as a user interface to the drive system. The drive system can include a power module and a control module which define desired functionalities for the system.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: A communication module is provided. The module includes at least one transceiver, a filter, a power amplifier, an enclosure, an internal interface and an external interface. The power amplifier is in communication with the at least one transceiver and filter. Moreover, the at least one transceiver, filter and power amplifier are tuned and calibrated to work with each other. The enclosure is configured to physically retain the at least one transceiver, filter and power amplifier. The internal interface is configured to interface connections between the at least one transceiver and the power amplifier and the external interface configured to provided external connections to the module. In addition, the external interface is coupled to the internal interface.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included.

Abstract: Systems and methods for a retractable fan cooling system for an electronics enclosure are provided. In one embodiment, a system comprises at least one cooling fan coupled to an electronics enclosure having a heat sink; and a fan positioning mechanism coupled to the at least one cooling fan. When a temperature inside the electronics enclosure is less than a first temperature, the positioning mechanism places the at least one cooling fan into a retracted position that does not inhibit a natural convective air flow across the heat sink. When the temperature inside the enclosure is greater than a second temperature, the positioning mechanism places the at least one cooling fan into an engaged position that produces a forced air flow across the heat sink.