Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

Abstract: A circuit board includes a first and second ground layer and a plurality of signal vias extending between the ground layers but not electrical contact therewith. Ground vias coupled to the first and second ground layers can be positioned adjacent signal vias and can include ground traces that extend between adjacent ground vias. Air holes can be positioned between signal vias and/or adjacent signal vias to modify the electrical performance of the circuit board. Ground wings can be used to help tune common-mode and/or differential-mode impedances.

Abstract: A hinge for an electronic device is provided. The electronic device has a first half and a second half. The hinge includes a rigid, multi-layer printed wiring board capable of being electrically coupled to the first half of the electronic device, and a flexible circuit electrically connected to the printed wiring board and capable of being electrically coupled to the second half of the electronic device. The printed wiring board is fixed relative to the first half. When the second half of the electronic device is moved relative to the first half, the flexible circuit winds and unwinds.

Abstract: An integrated contact is disposed on the end of a conical coil form. Fine magnet wire is soldered to the integrated contact and wound around the coil form to fabricate a high-frequency inductor for use in high-frequency chokes and other high-frequency devices. In one embodiment, the integrated contact is plated on the tip of a polyiron coil form and less than one turn of wire is wrapped around the plated portion of the polyiron coil form. The integrated contact has reduced contact area, reducing capacitive coupling and improving high-frequency electrical performance.

Abstract: A contiguous gasket provides an electromagnetic and environmental seal between the base and lid of a microcircuit housing. The base has a flat surface that allows easy access of tools for assembling electronic components. Channels are cut into a corresponding flat portion of the lid to accommodate the electronic components mounted on the base. High-frequency feedthroughs are brought through sidewall connector features of the base that rise above the assembly surface. Feedthroughs are optionally brought through the flat portion of the base as well. When the microcircuit housing is assembled, the lid compresses the gasket against the base to form an electromagnetic and environmental seal.