Patents by Inventor Michael J. Pfeifer

Michael J. Pfeifer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a flip chip semiconductor device having an inductor
    Patent number: 5541135
    Abstract: Flip chip bumps (24, 26, and 27) and an inductor (17) are simultaneously fabricated on a semiconductor substrate (10). The fabrication process includes two electroplating steps. The first step electroplates copper (18) onto a seed layer (13) to form the inductor (17) and a first portion (16) of the flip chip bumps (24, 26, and 27). The second step electroplates copper (21) onto the previously electroplated copper (18) to form a second portion (21) of the flip chip bumps (24, 26, and 27).
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: July 30, 1996
    Assignee: Motorola, Inc.
    Inventors: Michael J. Pfeifer, George W. Marlin