Patents by Inventor Michael J. Rowlands

Michael J. Rowlands has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a circuitized substrate
    Patent number: 9420689
    Abstract: A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: August 16, 2016
    Assignee: i3 Electronics, Inc.
    Inventors: Rabindra N. Das, Michael J. Rowlands
  • Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
    Publication number: 20110039212
    Abstract: A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
    Type: Application
    Filed: October 20, 2009
    Publication date: February 17, 2011
    Inventors: Rabindra N. Das, Michael J. Rowlands
  • Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
    Patent number: 7687724
    Abstract: A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: March 30, 2010
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, Michael J. Rowlands