Patents by Inventor Michael J. Ruminski

Michael J. Ruminski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In-Mold Decorated Component and Method
    Publication number: 20080070039
    Abstract: An in-mold decorated component and method provides a three-dimensional elevational emblem supported on a substrate base providing a subcomponent, and a formed foundation in-molded to and supporting the subcomponent. The emblem may be partially embedded, providing a soft look and feel.
    Type: Application
    Filed: March 9, 2007
    Publication date: March 20, 2008
    Inventors: Robin J. Reis, Michael J. Ruminski, Jay R. Mueller
  • Molded emblem with encapsulated embossed 3-D graphics
    Patent number: 6701652
    Abstract: An emblem (20, 20a, 20b) with encapsulated embossed 3-D graphics is provided by a substrate (22) having a first side (24) and an opposite second side (26), an ink pattern (28) printed on the second side and providing embossed 3-D graphics, and a transparent layer (30) molded on the first side and through which the graphics are viewable. The substrate is softer than the ink pattern and deforms therearound during molding of the transparent layer, to provide differing depths. A mold (36, 38) has a smooth nonembossed surface (42) engaging the second side of the substrate without a 3-D mold-insert.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: March 9, 2004
    Assignee: Serigraph, Inc.
    Inventors: Michael D. McElhatton, Michael G. Reindl, Michael J. Ruminski