Patents by Inventor Michael J. Sackrison

Michael J. Sackrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optimized contact design for thermosonic bonding of flip-chip devices
    Patent number: 7667236
    Abstract: A light emitting device (A) includes a semiconductor die (100).
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: February 23, 2010
    Assignee: Lumination LLC
    Inventors: Ivan Eliashevich, Hari Venugopalan, Xiang Gao, Michael J. Sackrison
  • Increased light extraction from a nitride LED
    Patent number: 7125734
    Abstract: In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in the etchant solution, exposed to the light for a prespecified period of time, removed from the solution, dried and diced into a plurality of LEDs. The LEDs are immediately packaged without any further processing.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: October 24, 2006
    Assignee: GELcore, LLC
    Inventors: Michael J. Sackrison, Hari S. Venugopalan, Xiang Gao