Patents by Inventor Michael J. Scheithauer
Michael J. Scheithauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7122069Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: GrantFiled: March 13, 2001Date of Patent: October 17, 2006Assignee: Osram Sylvania Inc.Inventors: Leonid P Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 7045113Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: GrantFiled: September 20, 2002Date of Patent: May 16, 2006Assignee: Osram Sylvania Inc.Inventors: Leonid P Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Publication number: 20030091457Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: ApplicationFiled: September 20, 2002Publication date: May 15, 2003Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 6375708Abstract: A W—Cu—Ni alloy having thermophysical properties suitable for use in electrical contacts and electrodes is described. The alloy is formed by direct sintering of a powder blend comprising a tungsten-copper composite powder and a nickel powder. The tungsten-copper composite powder component of the blend comprises individual dual phase particles having a copper phase and a tungsten phase wherein the tungsten phase substantially encapsulates the copper phase. The method for direct sintering the W—Cu—Ni alloy substantially eliminates the formation of brittle intermetallics and slumping during sintering.Type: GrantFiled: August 31, 2000Date of Patent: April 23, 2002Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Michael J. Scheithauer, Muktesh Paliwal, David L. Houck, James R. Spencer
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Publication number: 20020005086Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: ApplicationFiled: March 13, 2001Publication date: January 17, 2002Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 6103392Abstract: A high performance W--Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.Type: GrantFiled: November 17, 1995Date of Patent: August 15, 2000Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Gail T. Meyers, Frank J. Venskytis
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Patent number: 5956560Abstract: A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.Type: GrantFiled: January 15, 1997Date of Patent: September 21, 1999Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Muktesh Paliwal, Gail T. Meyers, Frank J. Venskytis
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Patent number: 5470549Abstract: A method for making a tungsten-copper composite oxide wherein an amount of an ammonium tungstate and an amount of an oxide or hydroxide of copper are combined without milling to form a mixture. The unmilled mixture is then dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide.Type: GrantFiled: December 22, 1994Date of Patent: November 28, 1995Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Nelson E. Kopatz
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Patent number: 5468457Abstract: A method of making a tungsten-copper composite oxide wherein an amount of an oxide of tungsten and an amount of an oxide of copper are combined to form a mixture, the oxide of tungsten or the oxide of copper, or both, being in a hydrated form. The mixture is then milled, dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide, the time sufficient to form the tungsten-copper composite oxide being at least about one-half the time sufficient to form the tungsten-copper composite oxide from a mixture of tungsten trioxide, WO.sub.3, and cupric oxide, CuO, under substantially similar conditions.Type: GrantFiled: December 22, 1994Date of Patent: November 21, 1995Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Nelson E. Kopatz
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Patent number: 5374802Abstract: A DC plasma arc generator and method of operation to reduce erosion of the internal parts. The arc generator includes a generally cylindrical anode and a generally cylindrical interelectrode having critical dimensions and spacing to allow introduction of vortical gas flows and stabilization of the primary arc thereby, reducing degradation and erosion of the generator.Type: GrantFiled: December 31, 1992Date of Patent: December 20, 1994Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Sanjay Sampath, Michael J. Scheithauer, Jack E. Vanderpool
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Patent number: 5296670Abstract: A DC plasma arc generator and method of operation including a generally cylindrical anode divided into an arc constricting portion and an exit portion lined with refractory liners and having critical dimensions and spacing to allow introduction of vortical gas flows and stabilization of the primary arc thereby, reducing degradation and erosion of the generator.Type: GrantFiled: December 31, 1992Date of Patent: March 22, 1994Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Sanjay Sampath, Michael J. Scheithauer, Jack E. Vanderpool