Patents by Inventor Michael J. Scheithauer

Michael J. Scheithauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7122069
    Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: October 17, 2006
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
  • Patent number: 7045113
    Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: May 16, 2006
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
  • Publication number: 20030091457
    Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.
    Type: Application
    Filed: September 20, 2002
    Publication date: May 15, 2003
    Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
  • Patent number: 6375708
    Abstract: A W—Cu—Ni alloy having thermophysical properties suitable for use in electrical contacts and electrodes is described. The alloy is formed by direct sintering of a powder blend comprising a tungsten-copper composite powder and a nickel powder. The tungsten-copper composite powder component of the blend comprises individual dual phase particles having a copper phase and a tungsten phase wherein the tungsten phase substantially encapsulates the copper phase. The method for direct sintering the W—Cu—Ni alloy substantially eliminates the formation of brittle intermetallics and slumping during sintering.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: April 23, 2002
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, Michael J. Scheithauer, Muktesh Paliwal, David L. Houck, James R. Spencer
  • Publication number: 20020005086
    Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.
    Type: Application
    Filed: March 13, 2001
    Publication date: January 17, 2002
    Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
  • Patent number: 6103392
    Abstract: A high performance W--Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
    Type: Grant
    Filed: November 17, 1995
    Date of Patent: August 15, 2000
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Gail T. Meyers, Frank J. Venskytis
  • Patent number: 5956560
    Abstract: A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
    Type: Grant
    Filed: January 15, 1997
    Date of Patent: September 21, 1999
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Muktesh Paliwal, Gail T. Meyers, Frank J. Venskytis
  • Patent number: 5470549
    Abstract: A method for making a tungsten-copper composite oxide wherein an amount of an ammonium tungstate and an amount of an oxide or hydroxide of copper are combined without milling to form a mixture. The unmilled mixture is then dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide.
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: November 28, 1995
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Nelson E. Kopatz
  • Patent number: 5468457
    Abstract: A method of making a tungsten-copper composite oxide wherein an amount of an oxide of tungsten and an amount of an oxide of copper are combined to form a mixture, the oxide of tungsten or the oxide of copper, or both, being in a hydrated form. The mixture is then milled, dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide, the time sufficient to form the tungsten-copper composite oxide being at least about one-half the time sufficient to form the tungsten-copper composite oxide from a mixture of tungsten trioxide, WO.sub.3, and cupric oxide, CuO, under substantially similar conditions.
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: November 21, 1995
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Nelson E. Kopatz
  • Patent number: 5374802
    Abstract: A DC plasma arc generator and method of operation to reduce erosion of the internal parts. The arc generator includes a generally cylindrical anode and a generally cylindrical interelectrode having critical dimensions and spacing to allow introduction of vortical gas flows and stabilization of the primary arc thereby, reducing degradation and erosion of the generator.
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: December 20, 1994
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, Sanjay Sampath, Michael J. Scheithauer, Jack E. Vanderpool
  • Patent number: 5296670
    Abstract: A DC plasma arc generator and method of operation including a generally cylindrical anode divided into an arc constricting portion and an exit portion lined with refractory liners and having critical dimensions and spacing to allow introduction of vortical gas flows and stabilization of the primary arc thereby, reducing degradation and erosion of the generator.
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: March 22, 1994
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, Sanjay Sampath, Michael J. Scheithauer, Jack E. Vanderpool