Patents by Inventor Michael J. Walk

Michael J. Walk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for tilted land grid array interconnects on a coreless substrate package
    Patent number: 7335979
    Abstract: An article of manufacture and system, as well as fabrication methods therefore, may include a plurality of lands disposed on a surface of a substrate wherein the lands are oriented at an angle to the surface of the substrate and further wherein the substrate is formed of conductive layers that are formed such that a non-conductive layer does not interpose between the conductive layers and their coupling.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: February 26, 2008
    Assignee: Intel Corporation
    Inventor: Michael J. Walk
  • Tilted land grid array package and socket, systems, and methods
    Patent number: 7220132
    Abstract: A electrical interface for an electronic package, using lands on the package which are non-planar with metal layers within the package. This non-planar or tilted land grid array (TLGA) package is assembled with a complementary TLGA socket to make electronic connection to the package.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: May 22, 2007
    Assignee: Intel Corporation
    Inventors: Brent S. Stone, Michael J. Walk
  • Integrated circuit package with low modulus layer and capacitor/interposer
    Patent number: 7042077
    Abstract: A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: May 9, 2006
    Assignee: Intel Corporation
    Inventors: Michael J. Walk, Hamid Azimi, John S. Guzek, Charan K. Gurumurthy
  • Package for a non-volatile memory device including integrated passive devices and method for making the same
    Publication number: 20040026715
    Abstract: Briefly, in accordance with one embodiment of the invention, a memory device package includes an integrated circuit die having a memory array and at least one passive component mounted to a substrate. In alternative embodiments, an array of solder balls may be mounted around the passive component.
    Type: Application
    Filed: May 5, 2003
    Publication date: February 12, 2004
    Inventors: Eleanor P. Rabadam, Michael J. Walk, Milan Keser
  • Package for a non-volatile memory device including integrated passive devices and method for making the same
    Publication number: 20030122173
    Abstract: Briefly, in accordance with one embodiment of the invention, a memory device package includes an integrated circuit die having a memory array and at least one passive component mounted to the integrated circuit component.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventors: Eleanor P. Rabadam, Michael J. Walk, Milan Keser