Patents by Inventor Michael J. Wang
Michael J. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12162965Abstract: Disclosed herein too is a method comprising charging to a reactor system a feed stream comprising a catalyst, a monomer and a solvent; reacting the monomer to form a polymer; where the polymer is contained in a single phase polymer solution; transporting the polymer solution to a pre-heater to increase the temperature of the polymer solution; charging the polymer solution to a liquid-liquid separator; reducing a pressure of the polymer solution in the liquid-liquid separator and separating a polymer-rich phase from a solvent-rich phase in the liquid-liquid separator; transporting the polymer-rich phase to a plurality of devolatilization vessels located downstream of the liquid-liquid separator, where each devolatilization vessel operates at a lower pressure than the preceding devolatilization vessel; and separating the polymer from volatiles present in the polymer rich phase.Type: GrantFiled: December 13, 2019Date of Patent: December 10, 2024Assignee: DOW GLOBAL TECHNOLOGIES LLCInventors: Alec Y. Wang, Jorge Rubalcaba, Michael D. Turner, Michael J. Zogg, Jr., Pradeep Jain
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Publication number: 20240402760Abstract: A head-mounted device may have a head-mounted housing containing rear-facing displays that display images for a user when the head-mounted housing is worn by the user. The head-mounted device housing may have housing structures such as elongated housing members with protruding posts. Multiple headbands may be removably coupled to the head-mounted device housing at the protruding posts. A first headband may have a strap with openings configured to receive the posts. Releasable latches may be provided to allow selective engagement and disengagement between the headband and the housing. A second headband may be coupled to the posts between the housing members and the first headband. Alternatively, the first headband may surround the post, and the second headband may be coupled to the post through the opening in the first headband. One or more hair guards and/or one or more keeper loops may be incorporated between the headbands.Type: ApplicationFiled: April 17, 2024Publication date: December 5, 2024Inventors: Ryan M David, Yuhao Pan, Evan A Cernokus, Erin M Bosch, Benjamin A Stevenson, Paul J Biestek, Paul X Wang, Katherine E Christensen, Michael Wu, James T Smith, Jered Singleton, Venkata Narayana Murthy Arelekatti, Chad J Miller
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Publication number: 20240386679Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.Type: ApplicationFiled: May 13, 2024Publication date: November 21, 2024Inventors: Michael J. Rockwell, Geoffrey Stahl, Thibaut Weise, Peter Kaufmann, Branko Petljanski, Jason L. Slupeiks, Tom Sengelaub, Kathrin Berkner Cieslicki, Yanghai Tsin, Hesam Najafi, Arthur Y. Zhang, Julian Hoenig, Julian Jaede, Jason C. Sauers, James W. Vandyke, Yoonhoo Jo, Forrest C. Wang, Cheng Chen, Graham B. Myhre, Fletcher R. Rothkopf, Marinus Meursing, Phil M. Hobson, Jan K. Quijalvo, Jia Tao, Ivan S. Maric, Jeremy C. Franklin, Wey-Jiun Lin, Bertrand Nepveu, Muhammad F. Hossain, William A. Sorrentino, III, Jonathan Ive, Alan C. Dye, Stephen O. Lemay
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Publication number: 20240386819Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.Type: ApplicationFiled: May 13, 2024Publication date: November 21, 2024Inventors: Michael J. Rockwell, Oriel Y. Bergig, Geoffrey Stahl, Thibaut Weise, Peter Kaufmann, Branko Petljanski, Jason L. Slupeiks, Tom Sengelaub, Kathrin Berkner Cieslicki, Yanghai Tsin, Hesam Najafi, Arthur Y. Zhang, Julian Hoenig, Julian Jaede, Yoonhoo Jo, Forrest C. Wang, Bertrand Nepveu, Muhammad F. Hossain, William A. Sorrentino, III, Jonathan Ive, Alan C. Dye, Stephen O. Lemay, Jeffrey M. Faulkner
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Publication number: 20240385453Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.Type: ApplicationFiled: May 13, 2024Publication date: November 21, 2024Inventors: Trevor J. Ness, Jason C. Sauers, Jeffrey C. Olson, Edward S. Huo, Samuel G. Smith, James W. Vandyke, Claire E. Dalke, Jeremy C. Franklin, Muhammad F. Hossain, Jia Tao, Wey-Jiun Lin, Jan K. Quijalvo, Ivan S. Maric, Fletcher R. Rothkopf, Stephen E. Dey, Phil M. Hobson, Anthony S. Montevirgen, Ritu Shah, Marinus Meursing, Matthew A. Mayer, Julian Hoenig, Julian Jaede, Yoonhoo Jo, Forrest C. Wang, Michael J. Rockwell, Neal D. Evans, Paul Meade
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Patent number: 12114947Abstract: A teleoperational system receives a movement command in response to movement of an input device, in response to determining an instrument is being controlled based on the movement of the input device, maps the movement command to a first movement of the instrument in an instrument frame using a first mapping, and in response to determining a tissue probe is being controlled based on the movement of the input device, maps the movement command to a second movement of the tissue probe in a tissue probe frame using a second mapping. The first mapping maps motion in an input direction in the input frame to an instrument direction in the instrument frame. The second mapping maps motion in the input direction to a tissue probe direction in the tissue probe frame. The instrument direction corresponding with the input direction. The tissue probe direction not corresponding with the input direction.Type: GrantFiled: August 27, 2021Date of Patent: October 15, 2024Assignee: INTUITIVE SURGICAL OPERATIONS, INC.Inventors: John Ryan Steger, Brian M. Crews, Craig R. Gerbi, Tyler J. Morrissette, Margaret M. Nixon, Joseph P. Orban, III, Theodore W. Rogers, Alain Sadaka, Charles E. Swinehart, Michael Turner, Kerry S. Wang
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Publication number: 20240337737Abstract: Systems and methods for transmitting non-diffracting acoustic beams are presented herein. In one example, a method for transmitting a non-diffracting acoustic beam with an ultrasound transducer that includes a plurality of transducer elements includes determining a transmit delay function and a transmit apodization function for the ultrasound transducer based on a target axial pressure profile for the acoustic beam for a given configuration of the ultrasound transducer and controlling the ultrasound transducer to transmit the acoustic beam by sending electrical signals to the plurality of transducer elements based on the transmit delay function and the transmit apodization function.Type: ApplicationFiled: April 10, 2023Publication date: October 10, 2024Inventors: Yuyang Gu, Anthony E. Samir, Kai Thomenius, Viksit Kumar, Michael J. Washburn, Michael H. Wang, Rimon Tadross
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Publication number: 20240332025Abstract: Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.Type: ApplicationFiled: June 13, 2024Publication date: October 3, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Francis J. CARNEY, Yusheng LIN, Michael J. SEDDON, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE
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Patent number: 12101426Abstract: An electronic device may have pixels that form an active area for a flexible display layer. An inactive area that is free of pixels may surround the active area. One or more edges of the flexible display layer may be bent around respective bend axes. The display layer may also have one or more unbent edges in which the inactive area and active area of the display have a planar shape. An image transport layer may have an input surface that receives the image and an output surface to which the image is transported. The image transport layer may be formed from a coherent fiber bundle or a layer of Anderson localization material. The coherent fiber bundle may have straight fibers that run parallel to each other in a vertical direction that is parallel to a surface normal of a central portion of the display layer.Type: GrantFiled: November 15, 2021Date of Patent: September 24, 2024Assignee: Apple Inc.Inventors: Tyler R. Kakuda, Hao Dong, Ian T. Clark, Jean-Pierre S. Guillou, Michael J. Brown, Paul C. Kelley, Shaorui Yang, Warren S. Rieutort-Louis, Yi Qiao, Ying-Chih Wang
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Publication number: 20240304128Abstract: An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.Type: ApplicationFiled: May 17, 2024Publication date: September 12, 2024Inventors: Ying-Chih Wang, Michael J. Brown, Michael B. Wittenberg, Paul C. Kelley, Rasamy Phouthavong, Tyler R. Kakuda, Jean-Pierre S. Guillou, Marwan Rammah
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Patent number: 12043573Abstract: This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials, pre-treating substrate materials to improve the adhesion of resin compositions to the substrate materials, and/or controlling gel formation of resin compositions. More particularly, the invention relates to compositions and methods for improving the adhesion of ring opening metathesis polymerization (ROMP) compositions to substrate materials using adhesion promoters containing isocyanate groups in a resin composition. The invention also relates to methods for improving the adhesion of resin compositions to substrate materials by pre-treating substrate materials with adhesion promoters containing isocyanate groups. The invention further relates to a method of providing a gel-modified ROMP composition, in which a hydroperoxide is added to a ROMP polymerizable resin composition in order to control gel formation of the polymerizing resin.Type: GrantFiled: July 1, 2021Date of Patent: July 23, 2024Assignee: MATERIA, INC.Inventors: Li-Sheng Wang, Anthony R. Stephen, Paul W. Boothe, Tessa Schulze, Michael A. Giardello, Mark S. Trimmer, Christopher J. Cruce, Farshad J. Motamedi, Brian Edgecombe
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Patent number: 12040192Abstract: Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.Type: GrantFiled: July 19, 2022Date of Patent: July 16, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Francis J. Carney, Yusheng Lin, Michael J. Seddon, Chee Hiong Chew, Soon Wei Wang, Eiji Kurose
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Publication number: 20190165414Abstract: Disclosed is a method for forming a solid state electrolyte. The method includes a first step of combining a solid comprising lithium, a second solid comprising lanthanum, a third solid comprising zirconium, and a fourth solid comprising bismuth to form a mixture. The method includes a second step of applying simultaneous heat and pressure to the mixture to form a ceramic material. The solid state electrolyte is ionically conducting and can be used as an electrolyte for an electrochemical device such as a battery or supercapacitor.Type: ApplicationFiled: November 29, 2018Publication date: May 30, 2019Inventors: Jeffrey Sakamoto, Michael J. Wang