Patents by Inventor Michael J. Witherspoon

Michael J. Witherspoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly having a heat pipe that conducts heat from a semiconductor die
    Patent number: 6535386
    Abstract: An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: March 18, 2003
    Assignee: Intel Corporation
    Inventors: Ajit V. Sathe, Michael J. Witherspoon, Ravi S. Prasher, Kristopher J. Frutschy
  • Electronic assembly having a heat pipe that conducts heat from a semiconductor die
    Publication number: 20020067598
    Abstract: An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.
    Type: Application
    Filed: December 5, 2000
    Publication date: June 6, 2002
    Inventors: Ajit V. Sathe, Michael J. Witherspoon, Ravi S. Prasher, Kristopher J. Frutschy