Patents by Inventor Michael J. Zylinski

Michael J. Zylinski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical emitter packages
    Patent number: 10459157
    Abstract: An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directly electrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: October 29, 2019
    Assignee: Analog Devices, Inc.
    Inventors: Eric P. Chojnacki, Michael J. Zylinski, Erik D. Barnes
  • Stress isolation features for stacked dies
    Patent number: 10287161
    Abstract: An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: May 14, 2019
    Assignee: ANALOG DEVICES, INC.
    Inventors: Xiaojie Xue, Michael J. Zylinski, Thomas M. Goida, Kathleen O. O'Donnell
  • OPTICAL EMITTER PACKAGES
    Publication number: 20180045882
    Abstract: An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directly electrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device.
    Type: Application
    Filed: August 11, 2017
    Publication date: February 15, 2018
    Inventors: Eric P. Chojnacki, Michael J. Zylinski, Erik D. Barnes
  • STRESS ISOLATION FEATURES FOR STACKED DIES
    Publication number: 20170022051
    Abstract: An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.
    Type: Application
    Filed: April 6, 2016
    Publication date: January 26, 2017
    Inventors: Xiaojie Xue, Michael J. Zylinski, Thomas M. Goida, Kathleen O. O'Donnell
  • Integrated Circuit with Back Side Conductive Paths
    Publication number: 20080087979
    Abstract: An integrated circuit has a substrate with a back side and a front side. The front side has both a working area and a front side contact in electrical communication with the working area. In a similar manner, the back side has first and second back side contacts. A first conductive path extending through the substrate electrically connects the front side contact and the first back side contact. In addition, a second conductive path electrically connects the first back side contact with the second back side contact.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 17, 2008
    Applicant: ANALOG DEVICES, INC.
    Inventors: Thomas M. Goida, Richard J. Sullivan, Michael J. Zylinski