Abstract: Aperture members are provided wherein there is thin 1–10 micrometer thick crystaline membrane that is surrounded by a frame of a bulk type crystalline material. The aperture being an opening through the membrane in a typical shape useful for device fabrication, such as a circle or pattern. The aperture member of the invention can be fabricated out of a typical silicon crystalline wafer in a process where doping in a region serves as an etch stop.

Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process.

Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process.

Abstract: The present invention provides methods and apparatus for the color calibration of displays. These methods are particularly useful for displays having properties different than those associated with cathode ray tubes (CRT). Some displays, for example liquid crystal displays (LCD), have a high luminance black, the chromas of their primaries are not independent of their luminance levels, the intensities of their primaries are not strictly monotonically increasing with respect to their RGB levels, the color additivity of their subpixels is affected by crosstalk or leakage and their color measurements are dependent on the view angle of the observer. Therefore, the usage of CRT methods is deficient for such displays.

Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process.

Abstract: Aperture members are provided wherein there is thin 1-10 micrometer thick crystaline membrane that is surrounded by a frame of a bulk type crystalline material. The aperture being an opening through the membrane in a typical shape useful for device fabrication, such as a circle or pattern. The aperture member of the invention can be fabricated out of a typical silicon crystalline wafer in a process where doping in a region serves as an etch stop.

Abstract: A portable computer laptop desk is provided when attached to a structure that in turn is supported on web strapping that passes over the upper legs of the operator when in the seated position. The strapping is attached to foldable and telescopable side and center supports for the structure that slide into and fold over the structure forming a package comparable in size to the portable computer.

Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process.

Abstract: In the invention a pellicle mounting structural principle is provided whereby a membrane for protection of an X-ray mask is interchangeably positioned with proper spacing between the X-ray mask and the resist on the wafer in which the pattern produced by the X-ray exposure is to be formed. The mounting principle employs a combined assembly of, a membrane and spacer member subassembly together with a means for seectably separable retention to the supporting structural portion of the mask The principle accommodates membrane materials that may not be flexible and provides an ability to remove the membrane for cleaning or replacement and to removal and reassembly with ease in reestablishing the spacing with respect to the mask. The means for the selectably separable retention to the supporting structural portion of the mask involves the use of springs and elastomers, securing to the sides of the supporting structural mask ring and the bonding of the spacer member directly to the mask.

Abstract: A lithographically patterned three dimensional stencil type mask is formed on a substrate over a specific area that is to undergo processing. The three dimensional mask functionally provides an energy beam stencil at a precise height over the specific area. The stencil has surface properties that provide a resist function for any scattering of a focused particle beam that passes through an aperture or opening in the center of the stencil, and is formed using standard in the art additive and subtractive processes so that it can be removed after the particle beam processing. It has a particular advantage in an application where it is desired to have sub regions in a pixel area in a liquid crystal display that can provide different domains which operate to provide different pretilt states to the liquid crystal which in turn widens the viewing range of the display.

Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.