Abstract: In some implementations, a method may include obtaining target fault data indicating a preselected fault for a vehicle having a hydrogen source. In addition, the method may include obtaining vehicle fault data indicating a fault of the vehicle. The method may include identifying a match between the fault and the preselected fault. Moreover, the method may include purging, in response to the identifying the match, hydrogen from the hydrogen source so as to reduce consequences of a battery thermal event by reducing the likelihood of a hydrogen-fueled fire.

Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

Abstract: A preform forming machine for producing a three-dimensional dry fiber preform may include a forming block assembly and a clamping plate assembly. The forming block assembly may have a forming table and a forming block and may be positionable in a series of forming block assemblies. The clamping plate assembly may have a clamping table and a clamping plate and may be positionable in a series of clamping plate assemblies arranged in opposing relation to the series of forming block assemblies. Each forming block may be configured to fold a ply stack over onto itself to form a web of a preform. Each clamping plate may be configured to clamp the ply stack to the forming table during the folding of the ply stack.

Abstract: A preform forming machine for producing a three-dimensional dry fiber preform may include a forming block assembly and a clamping plate assembly. The forming block assembly may have a forming table and a forming block and may be positionable in a series of forming block assemblies. The clamping plate assembly may have a clamping table and a clamping plate and may be positionable in a series of clamping plate assemblies arranged in opposing relation to the series of forming block assemblies. Each forming block may be configured to fold a ply stack over onto itself to form a web of a preform. Each clamping plate may be configured to clamp the ply stack to the forming table during the folding of the ply stack.