Patents by Inventor Michael James Haji-Sheikh

Michael James Haji-Sheikh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9618465
    Abstract: A capacitor for a hydrogen sensor includes a dielectric substrate, a first electrode on the dielectric substrate, a second electrode on the dielectric substrate, and palladium islands on the dielectric substrate and between the first and second electrodes. The palladium islands are electrically isolated from the first and second electrodes and from each other.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: April 11, 2017
    Assignee: Board of Trustees of Northern Illinois University
    Inventors: Martin Kocanda, Michael James Haji-Sheikh
  • Publication number: 20140326615
    Abstract: A capacitor for a hydrogen sensor includes a dielectric substrate, a first electrode on the dielectric substrate, a second electrode on the dielectric substrate, and palladium islands on the dielectric substrate and between the first and second electrodes. The palladium islands are electrically isolated from the first and second electrodes and from each other.
    Type: Application
    Filed: April 7, 2014
    Publication date: November 6, 2014
    Applicant: Board of Trustees of Northern Illinois University
    Inventors: Martin Kocanda, Michael James Haji-Sheikh
  • Patent number: 7109842
    Abstract: A robust sensor that incorporates the necessary physical structure and thermal characteristics is capable of measuring fluid flow and properties under harsh environmental conditions. The sensor die is made of a material with thermal conductivity tailored to provide the thermal transmission characteristics necessary to avoid saturation of the sensor, thus enabling the measurement of high mass flux airflow and liquid properties under high pressure and often harsh environments not previously available for silicon based sensors. The robust sensor further has internal vias for back-side electrical connection, thus avoiding electrical and mechanical interference with the measurements. All of these features come together to provide a microsensor which is capable of reliable, i.e. stable, wide dynamic range and rapid-response operation under harsh environments.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: September 19, 2006
    Assignee: Honeywell International Inc.
    Inventors: Aravind Padmanabhan, Ulrich Bonne, Michael James Haji-Sheikh
  • Publication number: 20030098771
    Abstract: A robust sensor that incorporates the necessary physical structure and thermal characteristics is capable of measuring fluid flow and properties under harsh environmental conditions. The sensor die is made of a material with thermal conductivity tailored to provide the thermal transmission characteristics necessary to avoid saturation of the sensor, thus enabling the measurement of high mass flux airflow and liquid properties under high pressure and often harsh environments not previously available for silicon based sensors. The robust sensor further has internal vias for back-side electrical connection, thus avoiding electrical and mechanical interference with the measurements. All of these features come together to provide a microsensor which is capable of reliable, i.e. stable, wide dynamic range and rapid-response operation under harsh environments.
    Type: Application
    Filed: January 7, 2003
    Publication date: May 29, 2003
    Inventors: Aravind Padmanabhan, Ulrich Bonne, Michael James Haji-Sheikh