Patents by Inventor Michael James Hill

Michael James Hill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11804426
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: October 31, 2023
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Publication number: 20210351116
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Application
    Filed: July 19, 2021
    Publication date: November 11, 2021
    Applicant: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Patent number: 11107757
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Publication number: 20200251411
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Applicant: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Patent number: 10672693
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: June 2, 2020
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Publication number: 20200091053
    Abstract: Disclosed herein are integrated circuit (IC) package supports having inductors with magnetic material therein. For example, in some embodiments, an IC package support may include an inductor including a solenoid, a first portion of a magnetic material in an interior of the solenoid, and a second portion of magnetic material outside the interior of the solenoid.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 19, 2020
    Applicant: Intel Corporation
    Inventors: Sameer Paital, Srinivas V. Pietambaram, Yonggang Li, Kristof Kuwawi Darmawikarta, Gang Duan, Krishna Bharath, Michael James Hill
  • Publication number: 20190304887
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Application
    Filed: April 3, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Publication number: 20080195038
    Abstract: Device (10) for dispensing a pre-defined quantity of oil to an ear, comprising a nozzle (20) operably coupled to the vessel (12) containing oil (14), the nozzle (20) being adapted to be placed in the ear and capable of expelling the oil (14) from the vessel (12) when desired and permitting expulsion when the vessel (12) and/or device (10) is in a substantially upright or substantially inverted position. The present application also relates to a kit of parts for producing the device (10).
    Type: Application
    Filed: May 17, 2005
    Publication date: August 14, 2008
    Inventors: Michael James Hill, Mark Llewellyn
  • Patent number: 6161198
    Abstract: A system and method for providing transaction indivisibility in a transaction processing system through the use of commonly-accessible modules for monitoring and maintaining proper source message sequencing is provided. A source message is transmitted from the host processing unit upon recovery of a failure of the host processing unit, where the source message includes information destined for the database, and an identifying sequence number. The identifying sequence number is compared to a stored sequence number, where the stored sequence number is associated with an immediately preceding source message received prior to the failure of the host processing unit. A source message indivisibility failure is indicated where the identifying sequence number is not consecutive with respect to the stored sequence number, while the source message is added to a message execution queue if the identifying sequence number is consecutive with respect to the stored sequence number.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: December 12, 2000
    Assignee: Unisys Corporation
    Inventors: Michael James Hill, Thomas Pearson Cooper, Dennis Richard Konrad, Thomas L. Nowatzki
  • Patent number: 6085200
    Abstract: A system and method for assembling database restoration data according to transaction in a transaction processing system. Database restoration data is collated by chronologically storing updated database records in distinct storage banks partitioned according to its corresponding transaction. Resulting database record blocks from storage banks associated with completed database transactions are queued in the order that their corresponding transactions were completed. The queued database record blocks are transferred to storage media, whereby the queued database record blocks are arranged on the storage media according to transaction, and in the order that the active transactions were completed.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: July 4, 2000
    Assignee: Unisys Corporation
    Inventors: Michael James Hill, Thomas Pearson Cooper, Dennis Richard Konrad, Thomas L. Nowatzki
  • Patent number: 6018746
    Abstract: A system and method for organizing and managing recovery information on a per-transaction basis using distinct memory structures is provided. A transaction processing system includes one or more transaction request units for initiating data transactions with a database. A memory architecture includes storage modules to store transaction recovery information that is used in recovering from a transaction processing failure, and further includes transaction descriptor memory structures each of which correspond to a distinct transaction. The transaction descriptors allow access to the transaction recovery information to be isolated from other transaction recovery information. A control information field in each transaction descriptor stores a transaction identifier that identifies the distinct transaction to which it corresponds.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: January 25, 2000
    Assignee: Unisys Corporation
    Inventors: Michael James Hill, Thomas Pearson Cooper, Dennis Richard Konrad, Thomas L. Nowatzki
  • Patent number: 5924097
    Abstract: A system and method for balancing database transaction request distribution between various hosts in a multiprocessor transaction processing system is provided. The transaction processing system includes a database and multiple host processors each coupled to at least one database transaction request unit. Database transaction requests sent from the host processors are collectively entered into a commonly-accessible load balancing queue. Each database transaction request is accompanied by a source identifier that identifies the database transaction request unit which initiated the corresponding database transaction request. The queued database transaction requests from the load balancing queue are processed by currently-available host processors, regardless of which host processor initiated the database transaction request.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: July 13, 1999
    Assignee: Unisys Corporation
    Inventors: Michael James Hill, Thomas Pearson Cooper, Dennis Richard Konrad, Thomas L. Nowatzki