Abstract: Examples are disclosed herein that relate to creating undercuts and other complex geometries in an injection molded article. One example provides a method of forming an injection molded article comprising an undercut structure, the method comprising inserting an insert piece into a mold for forming the molded article, the insert piece comprising sacrificial material, injection-molding the molded article, thereby incorporating the insert piece into the injection molded article, and machining the insert piece to form the undercut structure from the sacrificial material.

Abstract: An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.

Abstract: An electronic product includes an electronic enclosure having a housing pocket fabricated as a seamless single unitary molded structure. The single unitary molded structure defines a cavity therein and has at least one molded undercut feature extending over a portion of the cavity. The housing pocket includes a side opening that is sufficiently large to allow lateral insertion of the electronic assembly into position in the cavity with at least a portion of the electronic assembly extending underneath the at least one molded undercut feature.

Abstract: An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.

Abstract: An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.