Patents by Inventor Michael James Manfra

Michael James Manfra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929253
    Abstract: The present disclosure relates to a method of manufacturing a nanowire structure. According to an exemplary process, a substrate is firstly provided. An intact buffer region is formed over the substrate, and a sacrificial top portion of the intact buffer region is eliminated to provide a buffer layer with a planarized top surface. Herein, the planarized top surface has a vertical roughness below 10 ?. Next, a patterned mask with an opening is formed over the buffer layer, such that a portion of the planarized top surface of the buffer layer is exposed. A nanowire is formed over the exposed portion of the planarized top surface of the buffer layer through the opening of the patterned mask. The buffer layer is configured to have a lattice constant that provides a transition between the lattice constant of the substrate and the lattice constant of the nanowire.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: March 12, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey C. Gardner, Sergei V. Gronin, Raymond L. Kallaher, Michael James Manfra
  • Publication number: 20240065113
    Abstract: Methods of forming semiconductor-superconductor hybrid devices with a horizontally-confined channel are described. An example method includes forming a first isolated semiconductor heterostructure and a second isolated semiconductor heterostructure. The method further includes forming a left gate adjacent to a first side of each of the first isolated semiconductor heterostructure and the second isolated semiconductor heterostructure. The method further includes forming a right gate adjacent to a second side, opposite to the first side, of each of the first isolated semiconductor heterostructure and the second isolated semiconductor heterostructure, where a top surface of each of the left gate and the right gate is offset vertically from a selected surface of each of the first isolated semiconductor heterostructure and the second isolated semiconductor heterostructure by a predetermined offset amount.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 22, 2024
    Inventors: Geoffrey Charles GARDNER, Sergei Vyatcheslavovich GRONIN, Flavio GRIGGIO, Raymond Leonard KALLAHER, Noah Seth CLAY, Michael James MANFRA
  • Patent number: 11849639
    Abstract: Methods of forming semiconductor-superconductor hybrid devices with a horizontally-confined channel are described. An example method includes forming a first isolated semiconductor heterostructure and a second isolated semiconductor heterostructure. The method further includes forming a left gate adjacent to a first side of each of the first isolated semiconductor heterostructure and the second isolated semiconductor heterostructure. The method further includes forming a right gate adjacent to a second side, opposite to the first side, of each of the first isolated semiconductor heterostructure and the second isolated semiconductor heterostructure, where a top surface of each of the left gate and the right gate is offset vertically from a selected surface of each of the first isolated semiconductor heterostructure and the second isolated semiconductor heterostructure by a predetermined offset amount.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: December 19, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey Charles Gardner, Sergei Vyatcheslavovich Gronin, Flavio Griggio, Raymond Leonard Kallaher, Noah Seth Clay, Michael James Manfra
  • Patent number: 11798988
    Abstract: A nanowire structure includes a substrate, a graded planar buffer layer, a patterned mask, and a nanowire. The graded planar buffer layer is on the substrate. The patterned mask is on the graded planar buffer layer and includes an opening through which the graded planar buffer layer is exposed. The nanowire is on the graded planar buffer layer in the opening of the patterned mask. A lattice constant of the graded planar buffer layer is between a lattice constant of the substrate and a lattice constant of the nanowire. By providing the graded planar buffer layer, lattice mismatch between the nanowire and the substrate can be reduced or eliminated, thereby improving the quality and performance of the nanowire structure.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: October 24, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey C. Gardner, Sergei V. Gronin, Raymond L. Kallaher, Michael James Manfra
  • Patent number: 11793089
    Abstract: A hybrid heterostructure includes a semiconductor layer comprising indium antimonide, a superconductor layer comprising aluminum, and a screening layer between the semiconductor layer and the superconductor layer, the screening layer comprising indium arsenide. By including a screening layer of indium arsenide between the semiconductor layer of indium antimonide and the superconductor layer of aluminum, a high-performance and durable hybrid heterostructure suitable for use in quantum computing devices is provided.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: October 17, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Candice Fanny Thomas, Michael James Manfra
  • Publication number: 20230005743
    Abstract: The present disclosure relates to a nanowire structure, which includes a substrate with a substrate body and an ion implantation region, a patterned mask with an opening over the substrate, and a nanowire. Herein, the substrate body is formed of a conducting material, and the ion implantation region that extends from a top surface of the substrate body into the substrate body is electrically insulating. A surface portion of the substrate body is exposed through the opening of the patterned mask, while the ion implantation region is fully covered by the patterned mask. The nanowire is directly formed over the exposed surface portion of the substrate body and is not in contact with the ion implantation region. Furthermore, the nanowire is confined within the ion implantation region, such that the ion implantation region is configured to provide a conductivity barrier of the nanowire in the substrate.
    Type: Application
    Filed: September 1, 2022
    Publication date: January 5, 2023
    Inventors: Geoffrey C. GARDNER, Sergei V. GRONIN, Raymond L. KALLAHER, Michael James MANFRA
  • Patent number: 11488822
    Abstract: The present disclosure relates to a nanowire structure, which includes a substrate with a substrate body and an ion implantation region, a patterned mask with an opening over the substrate, and a nanowire. Herein, the substrate body is formed of a conducting material, and the ion implantation region that extends from a top surface of the substrate body into the substrate body is electrically insulating. A surface portion of the substrate body is exposed through the opening of the patterned mask, while the ion implantation region is fully covered by the patterned mask. The nanowire is directly formed over the exposed surface portion of the substrate body and is not in contact with the ion implantation region. Furthermore, the nanowire is confined within the ion implantation region, such that the ion implantation region is configured to provide a conductivity barrier of the nanowire in the substrate.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: November 1, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey C. Gardner, Sergei V. Gronin, Raymond L. Kallaher, Michael James Manfra
  • Publication number: 20220149262
    Abstract: A method of fabricating a semiconductor-superconductor hybrid device comprises providing a workpiece comprising a semiconductor component, a layer of a first superconductor material on the semiconductor component, and a layer of a second superconductor material on the first superconductor material, the second superconductor material being different from the first superconductor material; etching the layer of the second superconductor material to expose a portion of the first superconductor material; and oxidising the portion of the first superconductor material to form a passivating layer on the semiconductor. The first superconductor provides energy coupling between the semiconductor and the second superconductor, and the passivating layer protects the semiconductor while allowing electrostatic access thereto. Also provided are a hybrid device, and a method of etching.
    Type: Application
    Filed: December 23, 2021
    Publication date: May 12, 2022
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey Charles Gardner, Asbjørn Cennet Cliff Drachmann, Charles Masamed Marcus, Michael James Manfra
  • Patent number: 11211543
    Abstract: A method of fabricating a semiconductor-superconductor hybrid device comprises providing a workpiece comprising a semiconductor component, a layer of a first superconductor material on the semiconductor component, and a layer of a second superconductor material on the first superconductor material, the second superconductor material being different from the first superconductor material; etching the layer of the second superconductor material to expose a portion of the first superconductor material; and oxidising the portion of the first superconductor material to form a passivating layer on the semiconductor. The first superconductor provides energy coupling between the semiconductor and the second superconductor, and the passivating layer protects the semiconductor while allowing electrostatic access thereto. Also provided are a hybrid device, and a method of etching.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: December 28, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey Charles Gardner, Asbjørn Cennet Cliff Drachmann, Charles Masamed Marcus, Michael James Manfra
  • Patent number: 11201273
    Abstract: A device comprising: a portion of semiconductor; a portion of superconductor arranged to a enable a topological phase having a topological gap to be induced in a region of the semiconductor by proximity effect; and a portion of a non-magnetic material comprising an element with atomic number Z greater than or equal to 26, arranged to increase the topological gap in the topological region of the semiconductor.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 14, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Dmitry Igorevich Pikulin, Geoffrey Charles Gardner, Raymond Leonard Kallaher, Georg Wolfgang Winkler, Sergei Vyatcheslavovich Gronin, Peter Krogstrup Jeppesen, Michael James Manfra, Andrey Antipov, Roman Mykolayovych Lutchyn
  • Publication number: 20210375624
    Abstract: The present disclosure relates to a nanowire structure, which includes a substrate with a substrate body and an ion implantation region, a patterned mask with an opening over the substrate, and a nanowire. Herein, the substrate body is formed of a conducting material, and the ion implantation region that extends from a top surface of the substrate body into the substrate body is electrically insulating. A surface portion of the substrate body is exposed through the opening of the patterned mask, while the ion implantation region is fully covered by the patterned mask. The nanowire is directly formed over the exposed surface portion of the substrate body and is not in contact with the ion implantation region. Furthermore, the nanowire is confined within the ion implantation region, such that the ion implantation region is configured to provide a conductivity barrier of the nanowire in the substrate.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Inventors: Geoffrey C. GARDNER, Sergei V. GRONIN, Raymond L. KALLAHER, Michael James MANFRA
  • Publication number: 20210375623
    Abstract: The present disclosure relates to a method of manufacturing a nanowire structure. According to an exemplary process, a substrate is firstly provided. An intact buffer region is formed over the substrate, and a sacrificial top portion of the intact buffer region is eliminated to provide a buffer layer with a planarized top surface. Herein, the planarized top surface has a vertical roughness below 10 ?. Next, a patterned mask with an opening is formed over the buffer layer, such that a portion of the planarized top surface of the buffer layer is exposed. A nanowire is formed over the exposed portion of the planarized top surface of the buffer layer through the opening of the patterned mask. The buffer layer is configured to have a lattice constant that provides a transition between the lattice constant of the substrate and the lattice constant of the nanowire.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Inventors: Geoffrey C. GARDNER, Sergei V. GRONIN, Raymond L. KALLAHER, Michael James MANFRA
  • Patent number: 11127820
    Abstract: A quantum well field-effect transistor (QWFET) includes a barrier layer, a quantum well layer, and a spacer layer. The quantum well layer is on the barrier layer. The barrier layer and the spacer layer comprise aluminum indium antimonide that is undoped. The quantum well layer comprises indium antimonide. The spacer layer is on the quantum well layer. The quantum well layer and the spacer layer are between a source contact and a drain contact. A gate contact is on a dielectric layer, which is on the spacer layer. By providing the barrier layer and the spacer layer as undoped layers, a performance of the QWFET may be improved.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: September 21, 2021
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Michael James Manfra, Candice Fanny Thomas
  • Publication number: 20210280763
    Abstract: A semiconductor-superconductor hybrid structure includes a semiconductor layer and a superconductor heterostructure on the semiconductor layer. The superconductor heterostructure includes a first superconductor layer on the semiconductor layer and a second superconductor layer on the first superconductor layer. The first superconductor layer comprises a first superconducting material and the second superconductor layer comprises a second superconducting material that is different from the first superconducting material. By providing the superconductor heterostructure as multiple layers of different superconducting materials, the superconducting and physical properties of the superconductor heterostructure can be improved compared to conventional superconducting homostructures, thereby increasing the performance of the semiconductor-superconductor hybrid structure.
    Type: Application
    Filed: December 23, 2019
    Publication date: September 9, 2021
    Inventors: Geoffrey C. GARDNER, Raymond L. KALLAHER, Sergei V. GRONIN, Michael James MANFRA
  • Publication number: 20210210599
    Abstract: A nanowire structure includes a substrate, a graded planar buffer layer, a patterned mask, and a nanowire. The graded planar buffer layer is on the substrate. The patterned mask is on the graded planar buffer layer and includes an opening through which the graded planar buffer layer is exposed. The nanowire is on the graded planar buffer layer in the opening of the patterned mask. A lattice constant of the graded planar buffer layer is between a lattice constant of the substrate and a lattice constant of the nanowire. By providing the graded planar buffer layer, lattice mismatch between the nanowire and the substrate can be reduced or eliminated, thereby improving the quality and performance of the nanowire structure.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 8, 2021
    Inventors: Geoffrey C. GARDNER, Sergei V. GRONIN, Raymond L. KALLAHER, Michael James MANFRA
  • Publication number: 20210175408
    Abstract: A method of fabricating a semiconductor-superconductor hybrid device comprises providing a workpiece comprising a semiconductor component, a layer of a first superconductor material on the semiconductor component, and a layer of a second superconductor material on the first superconductor material, the second superconductor material being different from the first superconductor material; etching the layer of the second superconductor material to expose a portion of the first superconductor material; and oxidising the portion of the first superconductor material to form a passivating layer on the semiconductor. The first superconductor provides energy coupling between the semiconductor and the second superconductor, and the passivating layer protects the semiconductor while allowing electrostatic access thereto. Also provided are a hybrid device, and a method of etching.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 10, 2021
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey Charles Gardner, Asbjørn Cennet Cliff Drachmann, Charles Masamed Marcus, Michael James Manfra
  • Publication number: 20210126181
    Abstract: A semiconductor-superconductor hybrid device comprises a semiconductor, a superconductor, and a barrier between the superconductor and the semiconductor. The device is configured to enable energy level hybridisation between the semiconductor and the superconductor. The barrier is configured to increase a topological gap of the device. The barrier allows for control over the degree of hybridisation between the semiconductor and the superconductor. Further aspects provide a quantum computer comprising the device, a method of manufacturing the device, and a method of inducing topological behaviour in the device.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 29, 2021
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Georg Wolfgang Winkler, Roman Mykolayovych Lutchyn, Geoffrey Charles Gardner, Raymond Leonard Kallaher, Sergei Vyatcheslavovich Gronin, Michael James Manfra, Farhad Karimi
  • Publication number: 20210091294
    Abstract: A hybrid heterostructure includes a semiconductor layer comprising indium antimonide, a superconductor layer comprising aluminum, and a screening layer between the semiconductor layer and the superconductor layer, the screening layer comprising indium arsenide. By including a screening layer of indium arsenide between the semiconductor layer of indium antimonide and the superconductor layer of aluminum, a high-performance and durable hybrid heterostructure suitable for use in quantum computing devices is provided.
    Type: Application
    Filed: September 20, 2019
    Publication date: March 25, 2021
    Inventors: Candice Fanny THOMAS, Michael James MANFRA
  • Publication number: 20210091185
    Abstract: A quantum well field-effect transistor (QWFET) includes a barrier layer, a quantum well layer, and a spacer layer. The quantum well layer is on the barrier layer. The barrier layer and the spacer layer comprise aluminum indium antimonide that is undoped. The quantum well layer comprises indium antimonide. The spacer layer is on the quantum well layer. The quantum well layer and the spacer layer are between a source contact and a drain contact. A gate contact is on a dielectric layer, which is on the spacer layer. By providing the barrier layer and the spacer layer as undoped layers, a performance of the QWFET may be improved.
    Type: Application
    Filed: September 20, 2019
    Publication date: March 25, 2021
    Inventors: Michael James MANFRA, Candice Fanny THOMAS
  • Publication number: 20210083166
    Abstract: A device comprising: a portion of semiconductor; a portion of superconductor arranged to a enable a topological phase having a topological gap to be induced in a region of the semiconductor by proximity effect; and a portion of a non-magnetic material comprising an element with atomic number Z greater than or equal to 26, arranged to increase the topological gap in the topological region of the semiconductor.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 18, 2021
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Dmitry Igorevich Pikulin, Geoffrey Charles Gardner, Raymond Leonard Kallaher, Georg Wolfgang Winkler, Sergei Vyatcheslavovich Gronin, Peter Krogstrup Jeppesen, Michael James Manfra, Andrey Antipov, Roman Mykolayovych Lutchyn