Abstract: Methods and apparatus are provided for reducing the overall radiation hardness of a semiconductor chip. A radiation detector and a failure memory are provided. A disable signal or signals is produced by the failure memory. The disable signal is a required input to a user logic function, such as an off chip driver, an off chip receiver, a clock, or a static random access memory. When the radiation detector detects radiation, that detection is stored in the failure memory. The disable signal, when active, causes some or all of the user function to be inoperative. This invention is particularly important when the semiconductor chip is produced in a silicon on insulator (SOI) Complementary Metal Oxide Semiconductor (CMOS) process, which is naturally radiation resistant.

Abstract: Methods and apparatus are provided for reducing the overall radiation hardness of a semiconductor chip. A radiation detector and a failure memory are provided. A disable signal or signals is produced by the failure memory. The disable signal is a required input to a user logic function, such as an off chip driver, an off chip receiver, a clock, or a static random access memory. When the radiation detector detects radiation, that detection is stored in the failure memory. The disable signal, when active, causes some or all of the user function to be inoperative. This invention is particularly important when the semiconductor chip is produced in a silicon on insulator (SOI) Complementary Metal Oxide Semiconductor (CMOS) process, which is naturally radiation resistant.

Abstract: Embodiments are provided in which two or more sub-ALUs are interleaved to form a single ALU so as to shorten and reduce the number of the connection lines interconnecting the ALU to other devices.

Abstract: An electronic circuit and a method of designing the electronic circuit having conductive fill stripes which are electrically attached to the power distribution or to the signal routing of the circuit. Preferably, the conductive fill stripes are electrically attached to the power distribution and are interspersed between the power buses and signal wires on the various metal layers to satisfy the metal density requirements of integrated circuit and chip manufacturing. The conductive fill stripes are added during the design process after the placement of the power distribution and signal routing so that electrical continuity between the conductive fill stripes and the connecting bus, metal density requirements, other design rules and logic verification can be completed as the rest of the chip is designed.

Abstract: A multi-threaded memory (and associated method) for use in a multi-threaded computer system in which plural threads are used with a single processor. The multi-threaded memory includes: multi-threaded storage cells; at least one write decoder supplying information to a selected multi-threaded storage cell; and at least one read decoder accessing information from a selected multi-threaded storage cell. Each of the multi-threaded storage cells includes: N storage elements, where N.gtoreq.2, each of the N storage elements having a thread-correspondent content; a write interface supplying information to the intra-cell storage elements; and a read interface reading information from the intra-cell storage elements. At least one of the intra-cell read and write interfaces selects one of the thread-correspondent contents based at least in part by identifying the corresponding thread to achieve intra-cell thread-correspondent content selection.