Patents by Inventor Michael James Twohig
Michael James Twohig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250210959Abstract: Circuit breakers comprising high voltage micro-electromechanical systems (MEMS) switches are described. A MEMS teeter-totter switch connected between two terminals of the circuit breaker can include a beam coupled to an anchor on a substrate and two control electrodes disposed on a surface of the substrate. The circuit breaker includes one or more sensors that generate sensor signals indicative of operational conditions of the MEMS teeter-totter switch. A microcontroller generates control signals to change the state of the switch based at least in part on one of the sensor signals.Type: ApplicationFiled: December 20, 2024Publication date: June 26, 2025Inventors: Padraig L. Fitzgerald, Thomas O'Shea, Jonathan Ephraim David Hurwitz, Alan J. O'Donnell, David Aherne, Patrick Martin McGuinness, David J. Clarke, Richard T. Anslow, John Ross Wallrabenstein, Finbarr O'Leary, Michael P. Lynch, James Patrick Ryan, Michael James Twohig, Patrick Byrne, Danail Baylov, Blas Bogado, Damon Bosetti
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Publication number: 20250210282Abstract: High voltage microelectromechanical systems (MEMS) switches are described. The MEMS switches can be actively opened and closed. The switch can include a beam coupled to an anchor on a substrate by one or more hinges. The switch can include control electrodes, disposed on a surface of the substrate, for electrically controlling the beam. The anchor is asymmetrically positioned with respect to the two ends of the beam and is electrically connected to a middle electrode. A stopper serves as a pivot point during actuation of the switch to reduce the mechanical stress on the hinges.Type: ApplicationFiled: December 20, 2024Publication date: June 26, 2025Inventors: Padraig L. Fitzgerald, Thomas O'Shea, Jonathan Ephraim David Hurwitz, Alan J. O'Donnell, David Aherne, Patrick Martin McGuinness, David J. Clarke, Richard T. Anslow, John Ross Wallrabenstein, Finbarr O'Leary, Michael P. Lynch, James Patrick Ryan, Michael James Twohig, Patrick Byrne, Danail Baylov, Blas Bogado, Damon Bosetti
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Publication number: 20250210283Abstract: High voltage micro-electromechanical systems (MEMS) switches are described. A MEMS teeter-totter switch can include a beam coupled to an anchor on a substrate and two control electrodes, disposed on a surface of the substrate. A control circuit may include an isolator that provides an isolated activation voltage to a voltage supply and control circuit. The voltage supply and control circuit uses the isolated activation voltage to supply a control voltage to one of the control electrodes with respect to a first reference voltage, causing the beam to provide an input voltage received from an input terminal to a contact electrode of the MEMS teeter-totter switch electrically connected to an output terminal. The input voltage is applied on the beam with respect to a second reference voltage different from the first reference voltage.Type: ApplicationFiled: December 20, 2024Publication date: June 26, 2025Inventors: Padraig L. Fitzgerald, Thomas O'Shea, Jonathan Ephraim David Hurwitz, Alan J. O'Donnell, David Aherne, Patrick Martin McGuinness, David J. Clarke, Richard T. Anslow, John Ross Wallrabenstein, Finbarr O'Leary, Michael P. Lynch, James Patrick Ryan, Michael James Twohig, Patrick Byrne, Danail Baylov, Blas Bogado, Damon Bosetti
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Publication number: 20250211227Abstract: High voltage micro-electromechanical systems (MEMS) switches are described. A MEMS teeter-totter switch can include a beam coupled to an anchor on a substrate and two control electrodes, disposed on a surface of the substrate. A control circuit may include an optical isolator that provides an isolated activation voltage to a voltage supply and control circuit. The voltage supply and control circuit uses the isolated activation voltage to supply a control voltage to one of the control electrodes with respect to a first reference voltage, causing the beam to provide an input voltage received from an input terminal to a contact electrode of the MEMS teeter-totter switch electrically connected to an output terminal. The input voltage is applied on the beam with respect to a second reference voltage different from the first reference voltage.Type: ApplicationFiled: December 20, 2024Publication date: June 26, 2025Inventors: Padraig L. Fitzgerald, Thomas O'Shea, Jonathan Ephraim David Hurwitz, Alan J. O'Donnell, David Aherne, Patrick Martin McGuinness, David J. Clarke, Richard T. Anslow, John Ross Wallrabenstein, Finbarr O'Leary, Michael P. Lynch, James Patrick Ryan, Michael James Twohig, Patrick Byrne, Danail Baylov, Blas Bogado, Damon Bosetti
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Publication number: 20250210981Abstract: High voltage micro-electromechanical systems (MEMS) switches are described. A MEMS teeter-totter switch connected between two terminals of a circuit breaker can include a beam coupled to an anchor on a substrate and two control electrodes, disposed on a surface of the substrate. An electrical overstress device connected between the two terminals in parallel with the MEMS teeter-totter switch may protect the MEMS teeter-totter switch when a high voltage transient signal is applied across the teeter-totter switch.Type: ApplicationFiled: December 20, 2024Publication date: June 26, 2025Inventors: Padraig L. Fitzgerald, Thomas O'Shea, Jonathan Ephraim David Hurwitz, Alan J. O'Donnell, David Aherne, Patrick Martin McGuinness, David J. Clarke, Richard T. Anslow, John Ross Wallrabenstein, Finbarr O'Leary, Michael P. Lynch, James Patrick Ryan, Michael James Twohig, Patrick Byrne, Danail Baylov, Blas Bogado, Damon Bosetti
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Publication number: 20250030237Abstract: Apparatuses including spark gap structures for electrical overstress (EOS) monitoring or protection, and associated methods, are disclosed. In an aspect, a vertical spark gap device includes a substrate having a horizontal main surface and a plurality of pairs of conductive layers over the horizontal main surface. Different ones of the pairs are separated by different vertical distances such that each pair serves as an arcing electrode pair and different ones of the arcing electrode pairs are configured to arc discharge at different voltages.Type: ApplicationFiled: May 30, 2024Publication date: January 23, 2025Inventors: David J. Clarke, Alan J. O'Donnell, Shaun Stephen Bradley, Stephen Denis Heffernan, Patrick Martin McGuinness, Padraig L. Fitzgerald, Edward John Coyne, Michael P. Lynch, John Anthony Cleary, John Ross Wallrabenstein, Paul Joseph Maher, Andrew Christopher Linehan, Gavin Patrick Cosgrave, Michael James Twohig, Jan Kubik, Jochen Schmitt, David Aherne, Mary McSherry, Anne M. McMahon, Stanislav Jolondcovschi, Cillian Burke
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Patent number: 12202723Abstract: Microelectromechanical systems (MEMS) switches are disclosed. The MEMS switch may have an actuation voltage greater than the expected voltage of a signal being passed by the MEMS switch in normal operation. The MEMS switches may include a distributed hinge structure in some embodiments. Radial contact pads are included in some embodiments, with or separate from the distributed hinge.Type: GrantFiled: May 17, 2022Date of Patent: January 21, 2025Assignee: Analog Devices International Unlimited CompanyInventors: Padraig Fitzgerald, Michael James Twohig, James Lee Lampen, Philip James Brennan
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Publication number: 20240405519Abstract: Apparatuses including spark gap structures for electrical overstress (EOS) monitoring or protection, and associated methods, are disclosed. In an aspect, a vertical spark gap device includes a substrate having a horizontal main surface, a first conductive layer and a second conductive layer each extending over the substrate and substantially parallel to the horizontal main surface while being separated in a vertical direction crossing the horizontal main surface. One of the first and second conductive layers is electrically connected to a first voltage node and the other of the first and second conductive layers is electrically connected to a second voltage node. The first and second conductive layers serve as one or more arcing electrode pairs and have overlapping portions configured to generate one or more arc discharges extending generally in the vertical direction in response to an EOS voltage signal received between the first and second voltage nodes.Type: ApplicationFiled: May 30, 2024Publication date: December 5, 2024Inventors: David J. Clarke, Alan J. O'Donnell, Shaun Bradley, Stephen Denis Heffernan, Patrick Martin McGuinness, Padraig L. Fitzgerald, Edward John Coyne, Michael P. Lynch, John Anthony Cleary, John Ross Wallrabenstein, Paul Joseph Maher, Andrew Christopher Linehan, Gavin Patrick Cosgrave, Michael James Twohig, Jan Kubik, Jochen Schmitt, David Aherne, Mary McSherry, Anne M. McMahon, Stanislav Jolondcovschi, Cillian Burke
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Publication number: 20240405518Abstract: Apparatuses including spark gap structures for electrical overstress (EOS) monitoring or protection, and associated methods, are disclosed. In an aspect, a spark gap device includes first and second conductive layers formed over a substrate, where the first and second conductive layers are electrically connected to first and second voltage nodes, respectively. The first conductive layer includes a plurality of arcing tips configured to form arcing electrode pairs with the second conductive layer to form an arc discharge in response to an EOS voltage between the first and second voltage nodes. The spark gap device further includes a series ballast resistor electrically connected between the arcing tips and the first voltage node, where the ballast resistor in formed in a metallization layer over the substrate and a resistance of the series ballast resistor is substantially higher than a resistance of the second conductive layer.Type: ApplicationFiled: May 30, 2024Publication date: December 5, 2024Inventors: David J. Clarke, Alan J. O'Donnell, Shaun Bradley, Stephen Denis Heffernan, Patrick Martin McGuinness, Padraig L. Fitzgerald, Edward John Coyne, Michael P. Lynch, John Anthony Cleary, John Ross Wallrabenstein, Paul Joseph Maher, Andrew Christopher Linehan, Gavin Patrick Cosgrave, Michael James Twohig, Jan Kubik, Jochen Schmitt, David Aherne, Mary McSherry, Anne M. McMahon, Stanislav Jolondcovschi, Cillian Burke
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Publication number: 20240405517Abstract: Apparatuses including spark gap structures for electrical overstress (EOS) monitoring or protection, and associated methods, are disclosed. In an aspect, a spark gap array includes a sheet resistor and an array of arcing electrode pairs formed over a substrate. The array of arcing electrode pairs includes first arcing electrodes formed on the sheet resistor and a second arcing electrode arranged as a sheet formed over the first arcing electrodes and separated from the first arcing electrodes by an arcing gap. The first arcing electrodes and second arcing electrode are electrically connected to first and second voltage nodes, respectively, and the arcing electrode pairs are configured to generate arc discharges in response to an EOS voltage signal received between the first and second voltage nodes.Type: ApplicationFiled: May 30, 2024Publication date: December 5, 2024Inventors: David J. Clarke, Alan J. O'Donnell, Shaun Bradley, Stephen Denis Heffernan, Patrick Martin McGuinness, Padraig L. Fitzgerald, Edward John Coyne, Michael P. Lynch, John Anthony Cleary, John Ross Wallrabenstein, Paul Joseph Maher, Andrew Christopher Linehan, Gavin Patrick Cosgrave, Michael James Twohig, Jan Kubik, Jochen Schmitt, David Aherne, Mary McSherry, Anne M. McMahon, Stanislav Jolondcovschi, Cillian Burke
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Publication number: 20240304569Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: ApplicationFiled: May 21, 2024Publication date: September 12, 2024Inventors: Ramji Sitaraman Lakshmanan et al., Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Patent number: 12027472Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: GrantFiled: February 20, 2023Date of Patent: July 2, 2024Assignee: Analog Devices International Unlimited CompanyInventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Publication number: 20240087829Abstract: Impedance paths for integrated circuits having microelectromechanical systems (MEMS) switches that allow for electrical charge to bleed from circuit nodes to fixed electric potentials (e.g., ground) are described. Such paths are referred to herein as charge bleed circuits. The circuit nodes may be circuit locations where electrical charge may accumulate because there is no other path for the electrical charge to dissipate. In some embodiments, a charge bleed circuit includes a switchable device (e.g., a MEMS switch, a solid-state device switch, or a circuit including various solid-state device switches that, collectively, implement a device that can be switched on and off) that connects and disconnects the impedance path from a circuit node. This may allow the device to perform different types of measurements at desired performance levels.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Analog Devices International Unlimited CompanyInventors: Padraig Fitzgerald, David Aheme, Patrick M. McGuinness, Naveen Dhull, Michael James Twohig, Philip James Brennan, Donal P. McAuliffe
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Publication number: 20240087828Abstract: Microelectromechanical systems (MEMS) switches are disclosed. Parallel configurations of back-to-back MEMS switches are disclosed in some embodiments. An isolation connection of constant electrical potential may be made to a midpoint of the back-to-back switches. In some embodiments, a separate MEMS switch is provided as a shunt switch for the main MEMS switch. MEMS switch device configurations having multiple switchable signal paths each coupling a common input electrode to a respective output electrode are also disclosed. The MEMS switch device includes shunt switches each coupling a respective output electrode to a reference potential. The presence of a shunt switch coupled to an output electrode enhances the isolation of the signal path corresponding to that output electrode when the path is open.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Analog Devices International Unlimited CompanyInventors: Padraig Fitzgerald, Philip James Brennan, Jiawen Bai, Michael James Twohig, Bernard Patrick Stenson, Raymond C. Goggin, Mark Schirmer, Paul Lambkin, Donal P. McAuliffe, David Aherne, Cillian Burke, James Lee Lampen, Sumit Majumder
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Publication number: 20230207489Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: ApplicationFiled: February 20, 2023Publication date: June 29, 2023Inventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Patent number: 11616027Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: GrantFiled: November 18, 2020Date of Patent: March 28, 2023Assignee: Analog Devices International Unlimited CompanyInventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Publication number: 20220371882Abstract: Microelectromechanical systems (MEMS) switches are disclosed. The MEMS switch may have an actuation voltage greater than the expected voltage of a signal being passed by the MEMS switch in normal operation. The MEMS switches may include a distributed hinge structure in some embodiments. Radial contact pads are included in some embodiments, with or separate from the distributed hinge.Type: ApplicationFiled: May 17, 2022Publication date: November 24, 2022Applicant: Analog Devices International Unlimited CompanyInventors: Padraig Fitzgerald, Michael James Twohig, James Lee Lampen, Philip James Brennan
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Patent number: 11228310Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.Type: GrantFiled: October 26, 2020Date of Patent: January 18, 2022Assignee: Analog Devices Global Unlimited CompanyInventors: Ying Zhao, Alan O'Donnell, Michael James Twohig, Olly J. Kierse, James Thomas Sheeran, Michael C. W. Coln, Paul W. Stevens, Bruce A. Hecht, Padraig Fitzgerald, Mark Schirmer
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Publication number: 20210183790Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: ApplicationFiled: November 18, 2020Publication date: June 17, 2021Inventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Publication number: 20210067160Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.Type: ApplicationFiled: October 26, 2020Publication date: March 4, 2021Applicant: Analog Devices Global Unlimited CompanyInventors: Ying Zhao, Alan O'Donnell, Michael James Twohig, Olly J. Kierse, James Sheeran, Michael C.W. Coln, Paul W. Stevens, Bruce A. Hecht, Padraig Fitzgerald, Mark Schirmer