Patents by Inventor Michael Jason Fronckowiak

Michael Jason Fronckowiak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Edge protection on semiconductor substrates
    Patent number: 11830824
    Abstract: Exemplary methods of processing a semiconductor substrate may include forming a layer of dielectric material on the semiconductor substrate. The methods may include performing an edge exclusion removal of the layer of dielectric material. The methods may include forming a mask material on the semiconductor substrate. The mask material may contact the dielectric material at an edge region of the semiconductor substrate. The methods may include patterning an opening in the mask material overlying a first surface of the semiconductor substrate. The methods may include etching one or more trenches through the semiconductor substrate.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: November 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Amirhasan Nourbakhsh, Lan Yu, Joseph F. Salfelder, Ki Cheol Ahn, Tyler Sherwood, Siddarth Krishnan, Michael Jason Fronckowiak, Xing Chen
  • EDGE PROTECTION ON SEMICONDUCTOR SUBSTRATES
    Publication number: 20220310531
    Abstract: Exemplary methods of processing a semiconductor substrate may include forming a layer of dielectric material on the semiconductor substrate. The methods may include performing an edge exclusion removal of the layer of dielectric material. The methods may include forming a mask material on the semiconductor substrate. The mask material may contact the dielectric material at an edge region of the semiconductor substrate. The methods may include patterning an opening in the mask material overlying a first surface of the semiconductor substrate. The methods may include etching one or more trenches through the semiconductor substrate.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 29, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Amirhasan Nourbakhsh, Lan Yu, Joseph F. Salfelder, Ki Cheol Ahn, Tyler Sherwood, Siddarth Krishnan, Michael Jason Fronckowiak, Xing Chen