Abstract: The disclosure generally provides methods, systems and apparatus for networked drone systems. In an exemplary networked drone system, a plurality of smaller drones are attached to a fixed platform to increase delivery payload, distance, reliability and safety. As a drone nears charge depletion, it is replaced in-flight with a new drone. Thus, the networked drone system need not be grounded to replace the depleted drone. In another embodiment, flight efficiency is increased by providing collapsible wins to the networked drone system.

Abstract: Systems and methods may use a drone swarm to increase cargo capacity. A drone swarm may include a networked drone system or two or more drones, such as a parent drone and a child drone. A method may include receiving support component balance information captured by an inertial measurement unit on the support component supported by a parent drone, adjusting movement of the parent drone according to a control system using the support component balance information, receiving an indication of a low battery in a drone in the networked drone system, the indication including an identification of a replacement drone to replace the drone with the low battery in the networked drone system, and sending a reconfiguration command to at least one child drone to incorporate the replacement drone in the networked drone system.

Abstract: The disclosure generally provides methods, systems and apparatus for networked drone systems. In an exemplary networked drone system, a plurality of smaller drones are attached to a fixed platform to increase delivery payload, distance, reliability and safety. As a drone nears charge depletion, it is replaced in-flight with a new drone. Thus, the networked drone system need not be grounded to replace the depleted drone. In another embodiment, flight efficiency is increased by providing collapsible wins to the networked drone system.

Abstract: Systems and methods may use a drone swarm to increase cargo capacity. A drone swarm may include a networked drone system or two or more drones, such as a parent drone and a child drone. A method may include receiving support component balance information captured by an inertial measurement unit on the support component supported by a parent drone, adjusting movement of the parent drone according to a control system using the support component balance information, receiving an indication of a low battery in a drone in the networked drone system, the indication including an identification of a replacement drone to replace the drone with the low battery in the networked drone system, and sending a reconfiguration command to at least one child drone to incorporate the replacement drone in the networked drone system.

Abstract: One embodiment of a method and system is disclosed. The method configures a plurality of bond pads on a die arranged in a staggered array. The staggered array includes an inner and outer ring of bond pads. A first plurality of driver cells are placed to the outside of the plurality bond pads, and then a second plurality of driver cells are placed to the inside of the plurality of bond pads.

Abstract: An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.

Abstract: An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.

Abstract: A layout arrangement which provides a contouring of cells that allows the individual rectangular cell boundaries to overlap each other to a point at which individual device edges abut one another thereby utilizing die area which is normally lost to use. In order to attain this result, a new cell contour boundary is described about each cell at the edge of each individual device adjacent the exterior of the cell at a distance at which other cells may abut without disturbing the operation of the cell. Then, computer implemented processes are applied to cause the cells to fit abutting the newly described boundaries.

Abstract: A layout arrangement which provides a contouring of cells that allows the individual rectangular cell boundaries to overlap each other to a point at which individual device edges abut one another thereby utilizing die area which is normally lost to use. In order to attain this result, a new cell contour boundary is described about each cell at the edge of each individual device adjacent the exterior of the cell at a distance at which other cells may abut without disturbing the operation of the cell. Then, computer implemented processes are applied to cause the cells to fit abutting the newly described boundaries.

Abstract: An arrangement for providing power to a semiconductor array of cells on a substrate in which the metal 2 power conductors are truncated into short lengths sufficient only to reach between the metal 1 power conductors of adjacent rows of cells, the metal 2 power conductors are placed under the metal 4 power conductors at each side to reduce the current through the metal 3 power conductors, and the metal 3 power conductors are narrowed to the level necessary to carry the reduced current and placed adjacent upper or lower edges of the cells. The arrangement increases the amount of space available for access to the external connection nodes of the devices in the cells of a group on a substrate while reducing the size of the metal overlays necessary to carry power to the cells.

Abstract: The I/O buffer layout of a pad-limited die comprises a pad ring having four partially-overlapping I/O-buffer arrays arranged in a pinwheel pattern at the periphery of a square die. To enable electrical interconnection of transversely-overlapping I/O buffers with the core logic of the die, overlapping I/O buffers of adjacent I/O-buffer arrays are separated by routing channels and the circuitry of longitudinally-overlapping buffers is abridged so that each of these buffers is capable of performing only a limited range of functions.