Patents by Inventor Michael John Anderson

Michael John Anderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8810416
    Abstract: An assembly (13) for monitoring ionising radiation comprises a detector substrate (2) for generating electronic charge responsive to incident ionising radiation, the detector substrate (2) having an array of ionising radiation sense volumes (12) formed in it. A circuit substrate (14) supporting an array of read-out circuits (16) corresponding to the array of sense volumes is mechanically and electrically coupled to the detector substrate (14). Each of the read-out circuits (16) is switchable between first and second charge integration modes for receiving charge from a corresponding sense volume. A charge integration circuit (30) is configured in the first charge integration mode to integrate charge corresponding to sensing of a single ionising radiation detection event in a corresponding sense volume and in the second charge integrating mode to integrate charge corresponding to sensing a plurality of ionising radiation detection events in the corresponding sense volume.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: August 19, 2014
    Assignee: Radiation Watch Limited, LLC
    Inventors: Peter Trevor Doughty, Michael John Anderson, David Jeremy Prendergast, Ian Benson
  • Publication number: 20110121980
    Abstract: An assembly (13) for monitoring ionising radiation comprises a detector substrate (2) for generating electronic charge responsive to incident ionising radiation, the detector substrate (2) having an array of ionising radiation sense volumes (12) formed in it. A circuit substrate (14) supporting an array of read-out circuits (16) corresponding to the array of sense volumes is mechanically and electrically coupled to the detector substrate (14). Each of the read-out circuits (16) is switchable between first and second charge integration modes for receiving charge from a corresponding sense volume. A charge integration circuit (30) is configured in the first charge integration mode to integrate charge corresponding to sensing of a single ionising radiation detection event in a corresponding sense volume and in the second charge integrating mode to integrate charge corresponding to sensing a plurality of ionising radiation detection events in the corresponding sense volume.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 26, 2011
    Applicant: Radiation Watch Limited, LLC
    Inventors: Peter Trevor Doughty, Michael John Anderson, David Jeremy Prendergast, Ian Benson
  • Patent number: 7902976
    Abstract: An assembly (13) for monitoring ionising radiation comprises a detector substrate (2) for generating electronic charge responsive to incident ionising radiation, the detector substrate (2) having an array of ionising radiation sense volumes (12) formed in it. A circuit substrate (14) supporting an array of read-out circuits (16) corresponding to the array of sense volumes is mechanically and electrically coupled to the detector substrate (14). Each of the read-out circuits (16) is switchable between first and second charge integration modes for receiving charge from a corresponding sense volume. A charge integration circuit (30) is configured in the first charge integration mode to integrate charge corresponding to sensing of a single ionising radiation detection event in a corresponding sense volume and in the second charge integrating mode to integrate charge corresponding to sensing a plurality of ionising radiation detection events in the corresponding sense volume.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: March 8, 2011
    Assignee: Radiation Watch Limited
    Inventors: Peter Trevor Doughty, Michael John Anderson, David Jeremy Prendergast, Ian Benson
  • Patent number: 5928598
    Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
    Type: Grant
    Filed: May 9, 1997
    Date of Patent: July 27, 1999
    Assignee: Motorola, Inc.
    Inventors: Michael John Anderson, Gary Carl Johnson, Mark Phillip Popovich, Jeffrey Eames Christensen
  • Patent number: 5760526
    Abstract: A plastic molded SAW device (50) is provided by flip-chipping a SAW die (28) onto a die flag (16) of a lead frame (10) and attaching the two (28, 10) together by an annular ring (26, 60, 62) of an insulating material or other solder, so that an active central portion (52) of the SAW die (28) faces the die flag (16) but is separated therefrom. Electrical contacts to the circuitry on the SAW die (28) are made, most conveniently by solder bumps (36) which seal to electrode fingers (18) on the lead frame (10). This provides a very small sealed void (40, 74, 82) immediately above the active portion (52) of the SAW die (28) so that the attached die (28) and lead frame (10) combination can be over molded with plastic encapsulant (38) without such plastic encapsulant (38) coming in contact with the active region (52) of the SAW die surface (42).
    Type: Grant
    Filed: April 3, 1995
    Date of Patent: June 2, 1998
    Assignee: Motorola, Inc.
    Inventor: Michael John Anderson
  • Patent number: 5702775
    Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
    Type: Grant
    Filed: December 26, 1995
    Date of Patent: December 30, 1997
    Assignee: Motorola, Inc.
    Inventors: Michael John Anderson, Gary Carl Johnson, Mark Phillip Popovich, Jeffrey Eames Christensen