Abstract: An integrated device package is disclosed. The integrated device package can include an electronic component package which includes an electronic component. The integrated device package can include a protective material in which the electronic component is at least partially embedded, wherein the electronic component package comprises a first surface and a second surface. The integrated device package can include a heat sink plated on the first surface. The heat sink can include a base portion and a plurality of heat-dissipating projections extending outwardly therefrom.

Abstract: Surgical instruments suitable for use during surgical procedures. The surgical instruments include first and second halves coupled together at a pivot so that the halves define a handle and functional portions at proximal and distal ends of the instrument, respectively. The functional portion terminates at a blunt distal end and includes scissors, a base section disposed between the scissors and blunt distal end and having a first clamping feature, a tapering section disposed between the first clamping feature and blunt distal end and having gripping features, and opposing tips disposed between the tapering section and distal end of the instrument and having second clamping features.

Abstract: An electronic device is disclosed. The electronic device can include an electronic component. The electronic device can include a shaped body in which the electronic component is at least partially embedded, the shaped body comprising a base portion and a plurality of heat-dissipating projections extending outwardly therefrom. In some embodiments, the electronic device can include a passive electronic device, such as an inductor or transformer.

Abstract: Surgical instruments suitable for use during surgical procedures. The surgical instruments include first and second halves coupled together at a pivot so that the halves define a handle and functional portions at proximal and distal ends of the instrument, respectively. The functional portion terminates at a blunt distal end and includes scissors, a base section disposed between the scissors and blunt distal end and having a first clamping feature, a tapering section disposed between the first clamping feature and blunt distal end and having gripping features, and opposing tips disposed between the tapering section and distal end of the instrument and having second clamping features.

Abstract: An assembly (13) for monitoring ionising radiation comprises a detector substrate (2) for generating electronic charge responsive to incident ionising radiation, the detector substrate (2) having an array of ionising radiation sense volumes (12) formed in it. A circuit substrate (14) supporting an array of read-out circuits (16) corresponding to the array of sense volumes is mechanically and electrically coupled to the detector substrate (14). Each of the read-out circuits (16) is switchable between first and second charge integration modes for receiving charge from a corresponding sense volume. A charge integration circuit (30) is configured in the first charge integration mode to integrate charge corresponding to sensing of a single ionising radiation detection event in a corresponding sense volume and in the second charge integrating mode to integrate charge corresponding to sensing a plurality of ionising radiation detection events in the corresponding sense volume.

Abstract: An assembly (13) for monitoring ionising radiation comprises a detector substrate (2) for generating electronic charge responsive to incident ionising radiation, the detector substrate (2) having an array of ionising radiation sense volumes (12) formed in it. A circuit substrate (14) supporting an array of read-out circuits (16) corresponding to the array of sense volumes is mechanically and electrically coupled to the detector substrate (14). Each of the read-out circuits (16) is switchable between first and second charge integration modes for receiving charge from a corresponding sense volume. A charge integration circuit (30) is configured in the first charge integration mode to integrate charge corresponding to sensing of a single ionising radiation detection event in a corresponding sense volume and in the second charge integrating mode to integrate charge corresponding to sensing a plurality of ionising radiation detection events in the corresponding sense volume.

Abstract: An assembly (13) for monitoring ionising radiation comprises a detector substrate (2) for generating electronic charge responsive to incident ionising radiation, the detector substrate (2) having an array of ionising radiation sense volumes (12) formed in it. A circuit substrate (14) supporting an array of read-out circuits (16) corresponding to the array of sense volumes is mechanically and electrically coupled to the detector substrate (14). Each of the read-out circuits (16) is switchable between first and second charge integration modes for receiving charge from a corresponding sense volume. A charge integration circuit (30) is configured in the first charge integration mode to integrate charge corresponding to sensing of a single ionising radiation detection event in a corresponding sense volume and in the second charge integrating mode to integrate charge corresponding to sensing a plurality of ionising radiation detection events in the corresponding sense volume.

Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).

Abstract: A plastic molded SAW device (50) is provided by flip-chipping a SAW die (28) onto a die flag (16) of a lead frame (10) and attaching the two (28, 10) together by an annular ring (26, 60, 62) of an insulating material or other solder, so that an active central portion (52) of the SAW die (28) faces the die flag (16) but is separated therefrom. Electrical contacts to the circuitry on the SAW die (28) are made, most conveniently by solder bumps (36) which seal to electrode fingers (18) on the lead frame (10). This provides a very small sealed void (40, 74, 82) immediately above the active portion (52) of the SAW die (28) so that the attached die (28) and lead frame (10) combination can be over molded with plastic encapsulant (38) without such plastic encapsulant (38) coming in contact with the active region (52) of the SAW die surface (42).

Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).