Abstract: A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.

Abstract: A method of making a thermal interface material includes: combining a powder of diamond particles having a nominal dimension of 1,000 nm or less with a volatile liquid hydrocarbon material to provide a diamond dispersion; and combining the diamond dispersion with a first mixture to provide the thermal interface material, wherein the first mixture includes a matrix material and particles of a first material have a nominal dimension in a range from 1 micron to 100 microns, and wherein the diamond particles compose 0.5 wt. % to 5 wt. % of the thermal interface material, the matrix material composes 10 wt. % or less of the thermal interface material, and the first material composes at least 40 wt. % of the thermal interface material.

Abstract: Aspects of the disclosure relate generally to rack systems for housing computing devices. The rack may include shelves supported by flanges of a pair of corresponding inserts. The flanges may be spaced along the length of each of the inserts. The distance between the flanges may define the height of a shelf when placed in the rack. The pair of corresponding inserts may be placed along an inner sidewall of the rack by mating hooks of the inserts with corresponding slots of the inner sidewall and subsequently removed by demating the hooks and slots. For example, a pair of inserts with one distance between the flanges may be replaced by a pair of inserts with another distance between the flanges in order to increase the shelf height of the rack. By replacing the shelves and/or the inserts, a user may quickly and easily in order to reconfigure the rack.

Abstract: Aspects of the disclosure relate generally to rack systems for housing computing devices. The rack may include shelves supported by flanges of a pair of corresponding inserts. The flanges may be spaced along the length of each of the inserts. The distance between the flanges may define the height of a shelf when placed in the rack. The pair of corresponding inserts may be placed along an inner sidewall of the rack by mating hooks of the inserts with corresponding slots of the inner sidewall and subsequently removed by demating the hooks and slots. For example, a pair of inserts with one distance between the flanges may be replaced by a pair of inserts with another distance between the flanges in order to increase the shelf height of the rack. By replacing the shelves and/or the inserts, a user may quickly and easily in order to reconfigure the rack.

Abstract: Controlling a flatness of a first surface of a sheet material can include: (a) determining a first surface contour of the first surface of the sheet; (b) applying compressive stresses to one or more portions of the first surface of the sheet after the determination of the first surface contour of the sheet; (c) annealing compressive stresses in one or more portions of the first surface of the sheet after the determination of the first surface contour of the sheet; (d) determining a second surface contour of the first surface of the sheet after the compressive stresses have been applied to, and annealed from, the sheet; (e) comparing the second surface contour to a threshold flatness; and (f) performing (b)-(e) one or more times until the determined second surface contour is less than the threshold flatness.