Abstract: Systems and methods for generation and use of intellectual-property (IP) landscaping platform architectures are disclosed. A landscaping component may be utilized to produce refined clusters of IP assets using user seeded searches in varying areas of interest, such as, for example, target technical fields, targeted publications, targeted products, and/or competitor entity portfolios. The landscaping component may be further utilized to produce an interactive graphical element including a spatial representation of the clusters of IP assets. The interactive graphical element may include various functionalities and/or information associated with the clusters of IP assets.

Abstract: Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel or other structure are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin (under the compound, within the void) during the repair. Additionally or alternatively, presently disclosed systems and methods for deaerating a compound are configured to remove trapped air from the compound prior to use of the compound (e.g., prior to depositing the compound within a void for repairing the void). In some examples, the same system is configured to both deaerate the compound and deposit the deaerated compound to the void, all while in a reduced air pressure environment inside a vacuum chamber.

Abstract: Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin within the void during the repair. Systems may include a dispenser for holding the compound, a vacuum canister, and a valve operable to allow the compound to flow from the dispenser, through at least a portion of the vacuum canister, and into the void. After the compound flows into the void, the system is configured to apply ambient air pressure to the compound and the void, before the compound is allowed to harden or cure. Some such systems are pre-filled with the compound, and/or configured to be disposable after a single use.

Abstract: Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin within the void during the repair. Systems may include a dispenser for holding the compound, a vacuum canister, and a valve operable to allow the compound to flow from the dispenser, through at least a portion of the vacuum canister, and into the void. After the compound flows into the void, the system is configured to apply ambient air pressure to the compound and the void, before the compound is allowed to harden or cure. Some such systems are pre-filled with the compound, and/or configured to be disposable after a single use.

Abstract: Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel or other structure are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin (under the compound, within the void) during the repair. Additionally or alternatively, presently disclosed systems and methods for deaerating a compound are configured to remove trapped air from the compound prior to use of the compound (e.g., prior to depositing the compound within a void for repairing the void). In some examples, the same system is configured to both deaerate the compound and deposit the deaerated compound to the void, all while in a reduced air pressure environment inside a vacuum chamber.

Abstract: Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin within the void during the repair. Systems may include a dispenser for holding the compound, a vacuum canister, and a valve operable to allow the compound to flow from the dispenser, through at least a portion of the vacuum canister, and into the void. After the compound flows into the void, the system is configured to apply ambient air pressure to the compound and the void, before the compound is allowed to harden or cure. Some such systems are pre-filled with the compound, and/or configured to be disposable after a single use.