Patents by Inventor Michael John Flynn
Michael John Flynn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230207489Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: ApplicationFiled: February 20, 2023Publication date: June 29, 2023Inventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Patent number: 11616027Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: GrantFiled: November 18, 2020Date of Patent: March 28, 2023Assignee: Analog Devices International Unlimited CompanyInventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Publication number: 20210183790Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.Type: ApplicationFiled: November 18, 2020Publication date: June 17, 2021Inventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
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Patent number: 10843920Abstract: A microelectromechanical system (MEMS) device is provided that includes a substrate having a dielectric cavity formed therein and a movable electromechanical device suspended in the dielectric cavity. The dielectric cavity includes a substantially planar bottom surface and at least one sidewall surface extending substantially perpendicularly from the bottom surface. The movable electromechanical device is suspended in the dielectric cavity such that the movable electromechanical device is spaced apart from the bottom surface and the at least one sidewall surface of the dielectric cavity. The bottom surface of the cavity and each of the at least one sidewall surface of the cavity meet at a rectilinear corner.Type: GrantFiled: March 8, 2019Date of Patent: November 24, 2020Assignee: Analog Devices International Unlimited CompanyInventors: Kotlanka Rama Krishna, Michael John Flynn, Lynn Khine, Seamus Paul Whiston, Paul Lambkin
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Patent number: 10800649Abstract: Suspended microelectromechanical systems (MEMS) devices including a stack of one or more materials over a cavity in a substrate are described. The suspended MEMS device may be formed by forming the stack, which may include one or more electrode layers and an active layer, over the substrate and removing part of the substrate underneath the stack to form the cavity. The resulting suspended MEMS device may include one or more channels that extend from a surface of the device to the cavity and the one or more channels have sidewalls with a spacer material. The cavity may have rounded corners and may extend beyond the one or more channels to form one or more undercut regions. The manner of fabrication may allow for forming the stack layers with a high degree of planarity.Type: GrantFiled: November 28, 2016Date of Patent: October 13, 2020Assignee: Analog Devices International Unlimited CompanyInventors: Michael John Flynn, Paul Lambkin, Seamus Paul Whiston, Christina B. McLoughlin, Kotlanka Rama Krishna, Lynn Khine
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Publication number: 20200283291Abstract: A microelectromechanical system (MEMS) device is provided that includes a substrate having a dielectric cavity formed therein and a movable electromechanical device suspended in the dielectric cavity. The dielectric cavity includes a substantially planar bottom surface and at least one sidewall surface extending substantially perpendicularly from the bottom surface. The movable electromechanical device is suspended in the dielectric cavity such that the movable electromechanical device is spaced apart from the bottom surface and the at least one sidewall surface of the dielectric cavity. The bottom surface of the cavity and each of the at least one sidewall surface of the cavity meet at a rectilinear corner.Type: ApplicationFiled: March 8, 2019Publication date: September 10, 2020Applicant: Analog Devices International Unlimited CompanyInventors: Kotlanka Rama Krishna, Michael John Flynn, Lynn Khine, Seamus Paul Whiston, Paul Lambkin
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Publication number: 20180148318Abstract: Suspended microelectromechanical systems (MEMS) devices including a stack of one or more materials over a cavity in a substrate are described. The suspended MEMS device may be formed by forming the stack, which may include one or more electrode layers and an active layer, over the substrate and removing part of the substrate underneath the stack to form the cavity. The resulting suspended MEMS device may include one or more channels that extend from a surface of the device to the cavity and the one or more channels have sidewalls with a spacer material. The cavity may have rounded corners and may extend beyond the one or more channels to form one or more undercut regions. The manner of fabrication may allow for forming the stack layers with a high degree of planarity.Type: ApplicationFiled: November 28, 2016Publication date: May 31, 2018Applicant: Analog Devices GlobalInventors: Michael John Flynn, Paul Lambkin, Seamus Paul Whiston, Christina B. McLoughlin
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Patent number: 9941565Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.Type: GrantFiled: October 23, 2015Date of Patent: April 10, 2018Assignee: Analog Devices GlobalInventors: Conor John McLoughlin, Michael John Flynn, Laurence B. O'Sullivan, Shane Geary, Stephen O'Brien, Bernard P. Stenson, Baoxing Chen, Sarah Carroll, Michael Morrissey, Patrick M. McGuinness
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Patent number: 9887687Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.Type: GrantFiled: January 28, 2015Date of Patent: February 6, 2018Assignee: Analog Devices GlobalInventors: Seamus Paul Whiston, Bernard Patrick Stenson, Michael Noel Morrissey, Michael John Flynn
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Publication number: 20170117602Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.Type: ApplicationFiled: October 23, 2015Publication date: April 27, 2017Inventors: Conor John McLoughlin, Michael John Flynn, Laurence B. O'Sullivan, Shane Geary, Stephen O'Brien, Bernard P. Stenson, Baoxing Chen, Sarah Carroll, Michael Morrissey, Patrick M. McGuinness
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Publication number: 20160219719Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.Type: ApplicationFiled: January 28, 2015Publication date: July 28, 2016Inventors: Seamus Paul Whiston, Bernard Patrick Stenson, Michael Noel Morrissey, Michael John Flynn
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Patent number: 5665700Abstract: A Pharmaceutical formulation comprises a biologically active material such as insulin, erythropoietin, calcitonin and growth hormone, and, associated with it, a phospholipid for forming a material which participates in the alpha-glycerol or other pathways for the formation of lecithins which are found in the intestinal epithelial cell. Biologically active protein orally administered in such a formulation are bioavailable and bioactive.Type: GrantFiled: August 15, 1994Date of Patent: September 9, 1997Assignee: Skua Investments LimitedInventors: Young W. Cho, Michael John Flynn, Thomas Smith Shepherd
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Patent number: 5656289Abstract: Orally or rectally administrable formulations of biologically active material comprise a water-in-oil microemulsion, wherein the hydrophilic phase of the microemulsion comprises the biologically active material and the hydrophobic phase comprises chylomicra or material capable of forming chylomicra in the intestinal mucosa after administration. The biologically active material may be any of a wide range of substances including insulin, calcitonin and somatotrophin or growth hormone. Formulations of the invention are particularly suitable for the oral administration of insulin in the treatment of diabetes.Type: GrantFiled: February 16, 1994Date of Patent: August 12, 1997Assignee: Patralan LimitedInventors: Young W. Cho, Michael John Flynn