Abstract: A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner layer is preferably made from a resilient polymeric material, located between the electronic device and the outer shell, and adapted to cushion the electronic device from mechanical shock. A method of making the protected electronic assembly is also provided that includes providing an electronic device, disposing a resilient polymeric material as an inner layer around the electronic device to cushion the electronic device, and injection molding a rigid polymeric material as an outer shell around the resilient polymeric material to protect the electronic device.

Abstract: A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner layer is preferably made from a resilient polymeric material, located between the electronic device and the outer shell, and adapted to cushion the electronic device from mechanical shock.

Abstract: A circuit assembly 10 for holding an electronic component 26 relative to a circuit board 16 comprises a housing 12 coupled to the circuit board 16. A separable cradle 24 is coupled to the housing 12 and is sized to receive the electronic component 26. The cradle 24 has a support post 28 for spacing the cradle 25 a predetermined distance from the circuit board 16. In a further aspect of the invention, the housing 12 may be a module housing or a connector 14. The cradle 24 may be separable from the housing, Leads (26) pass through the cradle holes 46 and housing holes 44 to be soldered to the circuit board.

Abstract: A hermetically sealed automotive module is disclosed wherein a cover of the module is sealed to a housing of the module by vibration welding. A weld contact surface is defined between the cover and housing of the module when the cover and housing undergo relative reciprocating motion under the application of a force. A method for hermetically sealing a module is also disclosed.

Abstract: A spring clip assembly having integral backbone with a plurality of the spring clip members extending from the backbone, each spring clip member having a tapered loop. The loop tapers to an inwardly facing end. If desired, a special insertion tool can be used to provide for a zero insertion force assembly.